H5AN8G6NDJR-XNC: The 8Gb DDR4-3200 x16 DRAM Buyer's Guide

Admin · Aug 22, 2026 · 3 min read AI-Assisted · 2 views · Updated: Aug 22, 2026 · Fact-Checked
H5AN8G6NDJR-XNC is an 8Gb DDR4-3200 x16 DRAM from SK hynix, featuring 3200 Mbps data rate, 1.2V supply, FBGA-96 package. Active lifecycle, 99,999 units in stock, priced at $55.68 (qty 1000+) as of 2026-08-22.

Quick Answers: What is the H5AN8G6NDJR-XNC and Why Does It Matter?

The H5AN8G6NDJR-XNC is an 8Gb DDR4-3200 synchronous DRAM from SK hynix, organized as 512M x16, with a data rate of 3200 Mbps and a supply voltage of 1.2V (max 1.26V). It comes in a 96-ball FBGA package (13x7.5 mm) and is currently in active lifecycle status with 99,999 units in stock at XAIPART. As of 2026-08-22, the base price is $55.6818 for quantities of 1000 or more. This device is ideal for laptop memory upgrades, industrial controllers, networking equipment, and embedded systems.

Technical Guide: How to Select, Design In, and Use the H5AN8G6NDJR-XNC

When selecting the H5AN8G6NDJR-XNC, verify that your system's memory controller supports DDR4-3200 and a x16 data bus. The device operates at 1.2V (VDD) with a maximum of 1.26V, so ensure your power supply meets these requirements. The FBGA-96 package (13x7.5 mm) is surface-mount, requiring careful PCB layout for signal integrity. Follow DDR4 routing guidelines: maintain controlled impedance for DQ, DQS, and address/command lines, and place decoupling capacitors near VDD and VDDQ pins. The device supports features like auto self-refresh, ZQ calibration, and CRC, which enhance reliability. For design-in, refer to the SK hynix datasheet for timing parameters and AC/DC characteristics.

Alternatives & Comparison: Drop-In Replacements for the H5AN8G6NDJR-XNC

ParameterH5AN8G6NDJR-XNCH5AN8G6NCJR-XNCH5AN8G4NCJR-XNC
Memory TypeDDR4 SDRAMDDR4 SDRAMDDR4 SDRAM
Memory Size8 Gb8 Gb8 Gb
Memory Organization512M x16512M x162G x4
Data Rate3200 Mbps3200 Mbps3200 Mbps
Supply Voltage (VDD)1.2 V (max 1.26 V)1.2 V (max 1.26 V)1.2 V (max 1.26 V)
PackageFBGA-96 (13x7.5 mm)FBGA-96 (13x7.5 mm)FBGA-96 (13x7.5 mm)
Number of Terminals969696
Maximum Operating Temperature85 °C85 °C85 °C
RoHSCompliantCompliantCompliant

The H5AN8G6NCJR-XNC is a direct drop-in replacement with identical specifications, differing only in speed grade suffix. The H5AN8G4NCJR-XNC offers the same density but with a x4 data bus, which may require different PCB routing and controller support. Verify timing parameters before substitution.

Industry Insight: Market Position, Lifecycle, and Supply Situation

The H5AN8G6NDJR-XNC is in active lifecycle status, indicating ongoing production and availability. XAIPART currently holds 99,999 units in stock, ensuring immediate availability for most orders. The device is widely used in laptops, industrial controllers, networking equipment, and embedded systems, reflecting its strong market position in the DDR4 segment. As DDR4 remains a mainstream memory technology, supply is stable, though buyers should monitor market trends for potential shifts to DDR5.

Trends & Outlook: What Buyers Should Watch

With DDR4-3200 being a mature technology, the H5AN8G6NDJR-XNC offers a reliable and cost-effective solution for many applications. Buyers should watch for pricing trends, as DDR4 prices may fluctuate with market demand. The x16 organization simplifies PCB design, making it attractive for space-constrained designs. As AI edge devices and high-performance computing continue to grow, demand for high-density, high-bandwidth memory like this part is expected to remain strong. Consider long-term availability and potential transitions to DDR5 for new designs.

Frequently Asked Questions

The H5AN8G6NDJR-XNC has a memory size of 8Gb (gigabits), organized as 512M x16. According to the SK Hynix datasheet, this DDR4 SDRAM provides high density for main memory applications. The x16 organization means 16 data lines, offering high bandwidth per chip.
The H5AN8G6NDJR-XNC operates at a data rate of 3200 Mbps, which is DDR4-3200 speed grade. This is confirmed by multiple distributor listings including LCSC and Octopart. This high data rate enables fast data transfer for computing and embedded systems.
The H5AN8G6NDJR-XNC is housed in a 96-ball FBGA package with dimensions 13x7.5 mm. This is a standard DDR4 package, as listed on JLCPCB and other distributor sites. The FBGA-96 package is surface-mount and suitable for high-density PCB designs.
The H5AN8G6NDJR-XNC operates with a supply voltage (VDD) of 1.2V, with a maximum of 1.26V. This is standard for DDR4 memory, as per the Vyrian listing. The low voltage helps reduce power consumption compared to DDR3.
Yes, the H5AN8G6NDJR-XNC is RoHS compliant and lead-free. According to the JLCPCB listing, it is marked as ROHS. Additionally, the Alldatasheet entry for the related H5AN8G6NAFR indicates lead-free and halogen-free (RoHS compliant).
The H5AN8G6NDJR-XNC features auto self-refresh, auto precharge, data mask, dynamic on-chip termination, ZQ calibration, CRC function, write leveling, and asynchronous reset. These features enhance reliability and signal integrity, as listed on LCSC and JLCPCB.
The H5AN8G6NDJR-XNC is available from distributors such as LCSC (C2961593), Octopart, and Win Source. As of 2026-08-19, LCSC shows 3,000 units in stock at $45.1064. You can also check DigiKey and Mouser for availability.
As of 2026-08-19, the price for H5AN8G6NDJR-XNC is approximately $45.11 for a single unit, based on LCSC. Volume pricing may be lower; for example, at 1000 units, the price could be around $34.60. Prices vary by distributor and quantity.
The lead time for H5AN8G6NDJR-XNC depends on distributor stock. LCSC shows 3,000 units in stock as of 2026-08-19, indicating immediate availability. For larger quantities, lead time may be 4-8 weeks. Check with your preferred distributor for current lead times.
Yes, as of 2026-08-19, H5AN8G6NDJR-XNC is in stock at multiple distributors. LCSC reports 3,000 units, icDirectory reports 8,500 units, and Octopart reports 23,140 units. Availability can change, so verify with your distributor.
The H5AN8G6NDJR-XNC is an 8Gb x16 DDR4-3200 device, while the H5AN8G8NDJR-XNC is an 8Gb x8 DDR4-3200 device. The x16 version offers a wider data bus, which can simplify PCB routing for lower-density systems. The x8 version may be preferred for higher-density modules. Choose based on your system's data bus width requirements.
The H5AN8G6NDJR-XNC is an 8Gb x16 DDR4-3200 device, while the H5AN4G8NBJR-VKI is a 4Gb x8 DDR4-3200 device. The H5AN8G6NDJR-XNC has double the density and a wider data bus, making it suitable for applications requiring more memory capacity and bandwidth. The H5AN4G8NBJR-VKI is lower density and may be used in cost-sensitive designs.
Choose H5AN8G6NDJR-XNC when you need 8Gb density with a x16 interface. The H5ANAG8NCJR-XNC is a 16Gb x8 device, offering higher density but a narrower bus. If your system requires 8Gb per chip and a 16-bit data path, the H5AN8G6NDJR-XNC is the right choice. For higher density with x8, consider the H5ANAG8NCJR-XNC.
The best drop-in replacement for H5AN8G6NDJR-XNC is the H5AN8G6NCJR-XNC, which is the same 8Gb x16 DDR4-3200 device but with a different speed grade (likely -xxC). Both are pin-compatible and electrically similar. Other options include the H5AN8G6NAFR-UHC, which is also an 8Gb x16 DDR4-3200 part. Verify the speed grade and timing parameters before substitution.
Yes, the H5AN8G6NDJR-XNC can replace H5AN8G6NCJR-XNC if the speed grades are compatible. Both are 8Gb x16 DDR4-3200 devices with the same FBGA-96 package. The 'D' in the part number may indicate a different revision or feature set, but they are generally pin-compatible. Always verify the datasheet for timing and electrical specifications.
The H5AN8G6NDJR-XNC datasheet is available from SK Hynix's official website. You can download it from the product page at https://product.skhynix.com/download.do?attNo=1638&attTypeCd=TRT06. Additionally, Alldatasheet and GlobalSpec provide datasheet access for related parts.
The H5AN8G6NDJR-XNC pinout is detailed in the official SK Hynix datasheet. The device uses a 96-ball FBGA package with specific ball assignments for address, data, control, and power pins. Refer to the datasheet's pin configuration section for the exact pinout diagram.
Engineers should know that the H5AN8G6NDJR-XNC is an 8Gb DDR4 SDRAM organized as 512M x16, operating at 3200 Mbps with a 1.2V supply. It comes in a 96-ball FBGA package (13x7.5 mm) and supports features like auto self-refresh, ZQ calibration, and CRC. The maximum operating temperature is 85°C, and it is RoHS compliant.
The best Samsung equivalent for H5AN8G6NDJR-XNC is the K4A8G165WB-BCTD, which is an 8Gb x16 DDR4-3200 device in a FBGA-96 package. It is pin-compatible and electrically similar. Other Samsung options include K4A8G165WB-BCRC and K4A8G165WB-BCPB. Verify timing parameters before substitution.
The H5AN8G6NDJR-XNC can be replaced by the H5AN8G6NCJR-XNC (same brand, same specs), the H5AN8G6NAFR-UHC (same brand, similar), or the Samsung K4A8G165WB-BCTD (cross-brand, pin-compatible). All are 8Gb x16 DDR4-3200 devices in FBGA-96 packages. Ensure timing and electrical compatibility before use.
No, the H5AN8G6NDJR-XNC and H5AN8G6NCJR-XNC are not identical. The 'D' and 'C' in the part numbers may indicate different revisions or feature sets. Both are 8Gb x16 DDR4-3200 devices, but the 'D' version may have additional features or improved specifications. Check the datasheets for differences.

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