EP1K100FI256-2N vs EP1K50FC256-2N Comparison
Detailed side-by-side comparison of EP1K100FI256-2N by Intel and EP1K50FC256-2N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP1K100FI256-2N | EP1K50FC256-2N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $55.80 | $17.95 |
| Family | ACEX 1K | ACEX-1K |
| Series | EP1K100 | β |
| Logic Elements | 4,992 | β |
| System Gates | 100,000 | β |
| Logic Array Blocks (LABs) | 624 | 360 |
| Embedded Array Blocks (EABs) | 6 | 10 |
| Total RAM Bits | 49,152 | β |
| Maximum User I/O | 186 | β |
| Process Technology | 0.22 Β΅m CMOS | 0.22 Β΅m CMOS SRAM |
| Core Supply Voltage | 2.5 V | β |
| I/O Supply Voltage | 2.5 V / 3.3 V / 5.0 V (MultiVolt) | β |
| Speed Grade | -2 (faster bin) | -2 |
| Ball Finish | Leaded (SnPb) - 'N' suffix | β |
| Operating Temperature | -40 Β°C to +85 Β°C (Industrial) | 0 Β°C to 70 Β°C (Commercial) |
| Package | 256-ball FineLine BGA (FBGA-256) | 256-ball FBGA (FineLine BGA) |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| Configuration Interface | JTAG (IEEE 1149.1) + serial modes | β |
| RoHS Status | Non-compliant (leaded 'N' ball finish) | [DATA_NEEDED: RoHS status] |
| Logic Elements (LEs) | β | 2,880 |
| Typical Gates | β | 50,000 |
| Embedded Memory (bits) | β | 40,960 |
| Maximum User I/O Pins | β | 186 |
| Core Voltage (VCCINT) | β | 2.5 V (2.375 V to 2.625 V) |
| Package Dimensions | β | 16 x 16 mm |
| Configuration Method | β | JTAG / Passive Serial |