EP1K30FC256-3NAA vs EP1K30FC256-1N Comparison

Detailed side-by-side comparison of EP1K30FC256-3NAA by Intel and EP1K30FC256-1N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP1K30FC256-3NAA EP1K30FC256-1N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $11.50 $13.95
Product Category FPGA - Field Programmable Gate Array β€”
Family ACEX-1K ACEX-1K
Number of Logic Elements 1728 β€”
Number of Gates 30000 (30K) β€”
Embedded RAM Bits 24576 bits 24,576
Number of User I/Os 171 β€”
Maximum Internal Clock Frequency 200 MHz β€”
Core Supply Voltage 2.5 V β€”
IC Process Technology 0.22 um β€”
Package Type 256-ball FBGA (FineLine BGA) β€”
Package Form 256-BBGA β€”
Mounting Type Surface Mount Surface Mount
Speed Grade -3 (ordering code) -1
Configuration Type SRAM-based, external configuration device required β€”
Operating Temperature Range [DATA_NEEDED: operating temperature range] β€”
I/O Supply Voltage [DATA_NEEDED: VCCIO voltage options] β€”
Power Dissipation [DATA_NEEDED: typical power dissipation, design dependent] β€”
Lead-Free / RoHS [DATA_NEEDED: manufacturer PCN confirms RoHS status] β€”
Logic Elements β€” 1,728
Typical Gates β€” 30,000
Maximum User I/O β€” 171
Supply Voltage - Core β€” 2.5 V
Number of I/O Banks β€” [DATA_NEEDED: I/O banks]
Operating Temperature β€” 0C to +70C (commercial)
Package β€” 256-BGA (FineLine BGA, 17x17 mm)
Process Technology β€” 0.22 um SRAM CMOS
Configuration Method β€” SRAM (external PROM required)
Programming Interface β€” JTAG (IEEE 1149.1)
Lead Free / RoHS β€” Lead free per Altera/Intel product declaration
MSL Level β€” [DATA_NEEDED: MSL rating]
Internal Max Frequency β€” up to 250 MHz (family typical)

Datasheets & Resources

Browse All Products Create BOM Request Quote