EP1K50FC256-2N vs EP1K50FC256-3AA Comparison
Detailed side-by-side comparison of EP1K50FC256-2N by Intel and EP1K50FC256-3AA by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP1K50FC256-2N | EP1K50FC256-3AA |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $17.95 | $92.00 |
| Family | ACEX-1K | ACEX 1K Device Family (2.5V) |
| Logic Elements (LEs) | 2,880 | β |
| Typical Gates | 50,000 | β |
| Embedded Memory (bits) | 40,960 | β |
| Embedded Array Blocks (EABs) | 10 | β |
| Logic Array Blocks (LABs) | 360 | β |
| Maximum User I/O Pins | 186 | β |
| Core Voltage (VCCINT) | 2.5 V (2.375 V to 2.625 V) | β |
| Operating Temperature | 0 Β°C to 70 Β°C (Commercial) | 0 Β°C to 70 Β°C (commercial) |
| Process Technology | 0.22 Β΅m CMOS SRAM | 0.22 Β΅m CMOS SRAM |
| Speed Grade | -2 | -3 (faster tier) |
| Package | 256-ball FBGA (FineLine BGA) | 256-BGA (FBGA, 17x17 mm) |
| Package Dimensions | 16 x 16 mm | β |
| Configuration Method | JTAG / Passive Serial | SRAM (volatile, requires external config device) |
| RoHS Status | [DATA_NEEDED: RoHS status] | non_compliant (legacy BGA, pre-RoHS or exemption dependent on date code) |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| Series | β | ACEX-1K |
| Number of Logic Elements | β | 2880 |
| Number of LABs (Logic Array Blocks) | β | 360 |
| Total RAM Bits | β | 40960 |
| Number of I/O Pins | β | 186 |
| Number of Gates | β | 50000 (typical) |
| Core Voltage | β | 2.5 V (2.375 V to 2.625 V) |
| Number of PLLs | β | 4 (per family datasheet) |
| Number of Global Clocks | β | [DATA_NEEDED: number of global clocks] |