EP1M350F780C7N vs EP1M350F780C7ES Comparison
Detailed side-by-side comparison of EP1M350F780C7N by Intel and EP1M350F780C7ES by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP1M350F780C7N | EP1M350F780C7ES |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $168.00 | $0.00 |
| Family | Mercury (EP1M350) | β |
| Device Type | FPGA / Loadable PLD | β |
| Logic Cells | 14,400 | β |
| Gate Count | 350,000 | β |
| Core Supply Voltage | 1.8 V | β |
| User I/Os | 486 | β |
| Total Pins | 780 | β |
| Package Type | FC-FBGA / FINE LINE BGA-780 | FINE LINE BGA-780 |
| Terminal Pitch | 1.0 mm | β |
| Speed Grade | C7 (-7 commercial) | β |
| Operating Temperature | 0 C to 85 C (commercial) | 0 C to 85 C |
| Logic Family | CMOS | CMOS |
| Transceivers | Up to 18 channels, 1.25 Gbps CDR | β |
| Architecture | LUT-based, register-rich | β |
| RoHS Status | [DATA_NEEDED: RoHS compliance status] | unknown |
| Product Type | β | Field Programmable Gate Array (FPGA) |
| User I/O Count | β | 486 pins |
| Total Package Pins | β | 780 pins |
| Package Category | β | 780-BBGA |
| Supply Voltage | β | 1.8 V |
| Maximum Stated Transceiver Data Rate | β | 1.25 Gbps |
| Channels Supported at 1.25 Gbps | β | 8 channels |
| Remaining Channel Limit | β | 10 channels at 1.0 Gbps or less |
| Clock Data Recovery | β | Supported |
| High-Speed Transceivers | β | Integrated |
| Mounting Type | β | Surface Mount |
| REACH Status | β | unknown |
| Logic Element Count | β | [DATA_NEEDED: logic element count] |
| Embedded Memory Capacity | β | [DATA_NEEDED: embedded memory capacity] |
| Transceiver Count | β | [DATA_NEEDED: transceiver count] |
| Package Dimensions | β | [DATA_NEEDED: package dimensions] |
| Thermal Resistance | β | [DATA_NEEDED: junction-to-ambient thermal resistance] |