EP1SGX25DF1020I5N vs EP1SGX25DF1020I6N Comparison

Detailed side-by-side comparison of EP1SGX25DF1020I5N by Intel and EP1SGX25DF1020I6N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP1SGX25DF1020I5N EP1SGX25DF1020I6N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Last_time_buy Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $985.00 $165.00
Logic Family Stratix GX (FPGA) β€”
Process Technology 130 nm CMOS 130 nm CMOS
Logic Elements / Cells 25,660 β€”
Core Supply Voltage 1.5 V 1.425 V to 1.575 V (1.5 V nominal)
Operating Temperature 0 Β°C to 85 Β°C (industrial) 0 Β°C to +85 Β°C (industrial)
Package Type FC-FBGA (Flip-Chip FineLine BGA) β€”
Pin / Ball Count 1,020 β€”
Package Dimensions 33 Γ— 33 mm, 1.0 mm pitch β€”
Transceiver Channels Up to 20 CDR-based full-duplex channels β€”
Transceiver Data Rate 500 Mbps to 3.1875 Gbps per channel β€”
Aggregate Serial Bandwidth Up to 127.5 Gbps full-duplex β€”
Hard IP Protocols PCI Express, SerialLite II, XAUI, Serial RapidIO β€”
Mounting Type Surface Mount Surface Mount (BGA)
Lead Free Yes β€”
RoHS Status Compliant (per distributor data) Compliant
Family β€” Stratix GX
Series β€” EP1SGX25
Logic Elements β€” 25,660
Configurable Logic Blocks (CLBs) β€” 2,566
User I/Os β€” 607
Maximum Operating Frequency β€” [DATA_NEEDED: max internal clock frequency in MHz]
Multi-Gigabit Transceivers β€” Integrated (up to 3.125 Gbps per channel)
Package β€” 1020-ball FC-FBGA, 33 mm Γ— 33 mm, 1.0 mm pitch
Lead Finish β€” Lead Free
MSL Level β€” [DATA_NEEDED: moisture sensitivity level]
Memory β€” Embedded TriMatrix memory blocks
DSP Blocks β€” Integrated DSP blocks for fixed/floating-point arithmetic
Clock Management β€” PLLs with dynamic phase alignment (DPA)
Grade Identifier β€” I6 (industrial, speed grade 6)
Manufacturer β€” Intel (formerly Altera)

Datasheets & Resources

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