EP1SGX25DF672C6 vs EP1SGX25DF672I5 Comparison
Detailed side-by-side comparison of EP1SGX25DF672C6 by Intel and EP1SGX25DF672I5 by Altera. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP1SGX25DF672C6
EP1SGX25DF672C6 - Stratix GX FPGA 25K LE 672-BGA | Intel / Altera
EP1SGX25DF672C6 ObsoleteAltera
EP1SGX25DF672I5
EP1SGX25DF672I5 - Stratix GX FPGA, 25K LE, 672-FBGA | Altera
EP1SGX25DF672I5 NrndSpecification Comparison
| Parameter | EP1SGX25DF672C6 | EP1SGX25DF672I5 |
|---|---|---|
| Brand | Intel | Altera |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $96.50 | $355.00 |
| Series | Stratix GX | β |
| Logic Elements | 25,660 LE | 25,660 |
| Number of LABs | 2,566 | β |
| Total RAM Bits | 1,944,576 bits | β |
| User I/O Count | 455 | β |
| Number of Transceivers | 6 channels (per Stratix GX family) | β |
| Max Transceiver Data Rate | 3.125 Gbps | β |
| Core Voltage | 1.5 V | β |
| Operating Temperature | 0C to +85C (commercial) | β |
| Package | 672-BBGA FineLine BGA | 672-ball FC-FBGA (Flip-Chip Fine-pitch BGA) |
| Package Dimensions | 33 x 33 mm | β |
| Ball Pitch | 1.0 mm | β |
| Mounting Type | Surface Mount | Surface Mount |
| Lead-Free / RoHS | Lead-Free (per FBGA suffix family) | β |
| Process Technology | CMOS | 130 nm CMOS |
| Family | β | Stratix GX |
| Configurable Logic Blocks (CLBs) | β | 2,566 |
| Embedded Memory Bits | β | 1,944,576 |
| Core Supply Voltage | β | 1.5 V |
| Operating Temperature Grade | β | Military (-55C to +125C) |
| Form of Terminal | β | Ball |
| Package Code | β | BGA |
| Package Shape | β | Square |
| Number of Terminals | β | 672 |
| RoHS Status | β | [DATA_NEEDED: rohs_status] |
| Lead-Free | β | [DATA_NEEDED: lead_free_status] |