EP1SGX25DF672I7 vs EP1SGX25DF672I7N Comparison

Detailed side-by-side comparison of EP1SGX25DF672I7 by Intel and EP1SGX25DF672I7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP1SGX25DF672I7 EP1SGX25DF672I7N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $1,190.00 $162.00
Series Stratix GX β€”
Family Stratix GX (EP1SGX25) Stratix GX
Logic Elements 25,660 25,660
Configurable Logic Blocks (CLBs) 2,566 β€”
Total RAM Bits 1,944,576 β€”
Number of Logic Array Blocks (LABs) 455 β€”
Maximum Internal Clock Frequency 4385.97 MHz β€”
Combinatorial CLB Delay (max) 9.48 ns β€”
Process Technology CMOS 130 nm 130 nm CMOS
Nominal Supply Voltage 1.5 V β€”
Supply Voltage Range 1.425 V to 1.575 V 1.425 V to 1.575 V
Operating Temperature Grade MILITARY / Industrial β€”
Speed Grade I7 (slowest industrial) β€”
Package Code DF (672-ball FC-FBGA) β€”
Number of Terminals 672 672
Terminal Form Ball (BGA) Ball (BGA)
Package Shape Square β€”
Mounting Type Surface Mount (BGA) Surface Mount (BGA)
RoHS Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: rohs status]
CLBs β€” 2,566
Maximum Operating Frequency β€” 4385.97 MHz (logic); 4.7 MHz (combinatorial CLB delay rating)
Combinatorial Delay (CLB) β€” 9.48 ns max
High-Speed Transceiver Channels β€” 4
Transceiver Data Rate β€” 500 Mbps to 3.1875 Gbps per channel
Core Supply Voltage (VCCINT) β€” 1.5 V
Package β€” 672-ball FineLine BGA (FC-FBGA), 33 Γ— 33 mm, 1 mm pitch
Logic Family β€” CMOS
Operating Temperature β€” 0 Β°C to 85 Β°C (industrial)
Lead-Free β€” Yes

Datasheets & Resources

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