EP1SGX25DF672I7N vs EP1SGX25DF672C5N Comparison

Detailed side-by-side comparison of EP1SGX25DF672I7N by Intel and EP1SGX25DF672C5N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP1SGX25DF672I7N EP1SGX25DF672C5N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $162.00 $1,232.25
Family Stratix GX β€”
Logic Elements 25,660 25,660 LE
CLBs 2,566 β€”
Maximum Operating Frequency 4385.97 MHz (logic); 4.7 MHz (combinatorial CLB delay rating) β€”
Combinatorial Delay (CLB) 9.48 ns max β€”
Process Technology 130 nm CMOS 130 nm CMOS
High-Speed Transceiver Channels 4 β€”
Transceiver Data Rate 500 Mbps to 3.1875 Gbps per channel Up to 3.1875 Gbps
Core Supply Voltage (VCCINT) 1.5 V β€”
Supply Voltage Range 1.425 V to 1.575 V β€”
Package 672-ball FineLine BGA (FC-FBGA), 33 Γ— 33 mm, 1 mm pitch β€”
Logic Family CMOS β€”
Operating Temperature 0 Β°C to 85 Β°C (industrial) 0 C to 85 C (Commercial)
Lead-Free Yes β€”
RoHS Status [DATA_NEEDED: rohs status] β€”
Mounting Type Surface Mount (BGA) Surface Mount (FBGA)
Terminal Form Ball (BGA) β€”
Number of Terminals 672 β€”
Series β€” Stratix GX
User I/O Count β€” 455
Total RAM Bits β€” 1,944,576 bits
Supply Voltage (Core) β€” 1.5 V (1.425 V to 1.575 V)
Number of Transceivers β€” 20
DSP Blocks β€” 10 (dedicated 18x18 multipliers)
Package Type β€” 672-ball Flip-Chip BGA (FBGA-672)
Package Dimensions β€” 27 mm x 27 mm, 1.0 mm pitch
Speed Grade β€” C5
Configuration Modes β€” PS, PPS, FPP, JTAG
Lead Free / RoHS β€” Lead free per Altera/Intel datasheet

Datasheets & Resources

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