EP1SGX25DF800C5N vs EP1SGX25DF672C5N Comparison

Detailed side-by-side comparison of EP1SGX25DF800C5N by Intel and EP1SGX25DF672C5N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP1SGX25DF800C5N EP1SGX25DF672C5N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $158.00 $1,232.25
Family Stratix GX β€”
Device Logic Elements 25,660 (typical) β€”
Transceiver Channels 8 (full-duplex) β€”
Maximum Transceiver Data Rate 3.1875 Gbps per channel β€”
Process Technology 130 nm 130 nm CMOS
Supply Voltage (Core) 1.5 V typical 1.5 V (1.425 V to 1.575 V)
Package FBGA-800 (FineLine BGA, 31x31 mm) β€”
Speed Grade C5 (commercial) C5
Operating Temperature 0C to +85C (commercial) 0 C to 85 C (Commercial)
Lead-Free / RoHS Status Lead-free (N suffix) β€”
On-Chip Memory (TriMatrix) Approx. 2 Mbits total β€”
PLLs Up to 40 (device-wide) β€”
Embedded 8b/10b Encoder/Decoder Yes (one per transceiver channel) β€”
PCI Express Hard IP x1, x4 endpoints supported β€”
DSP Blocks Embedded multiplier blocks (family-wide) 10 (dedicated 18x18 multipliers)
Mounting Type Surface Mount (BGA) Surface Mount (FBGA)
MSL Level [DATA_NEEDED: MSL Level] β€”
Development Software Quartus II (legacy) β€”
Series β€” Stratix GX
Logic Elements β€” 25,660 LE
User I/O Count β€” 455
Total RAM Bits β€” 1,944,576 bits
Transceiver Data Rate β€” Up to 3.1875 Gbps
Number of Transceivers β€” 20
Package Type β€” 672-ball Flip-Chip BGA (FBGA-672)
Package Dimensions β€” 27 mm x 27 mm, 1.0 mm pitch
Configuration Modes β€” PS, PPS, FPP, JTAG
Lead Free / RoHS β€” Lead free per Altera/Intel datasheet

Datasheets & Resources

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