EP1SGX25DF800I6N vs EP1SGX25CF672I6 Comparison

Detailed side-by-side comparison of EP1SGX25DF800I6N by Intel and EP1SGX25CF672I6 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP1SGX25DF800I6N EP1SGX25CF672I6
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Last_time_buy Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $1,450.00 $171.00
Family Stratix GX Stratix GX
Logic Elements [DATA_NEEDED: logic element count] 25,660
Transceiver Channels 4 to 20 channels β€”
Maximum Transceiver Data Rate 3.1875 Gbps per channel β€”
CDR / SERDES Embedded clock-data recovery and SERDES β€”
Memory TriMatrix memory, up to 2 Mbits β€”
DSP Blocks Up to 22 DSP blocks [DATA_NEEDED: DSP block count per Stratix GX device data sheet]
Hard IP PCI Express PHY, external memory interfaces (DDR, DDR-II, QDR-II, RLDRAM-II) β€”
Source-Synchronous Channels 8 channels β€”
I/O Standards LVDS, LVTTL, LVCMOS, SSTL, HSTL β€”
Package 800-pin FineLine BGA (DF800) 672-ball FBGA (27 x 27 mm, 1 mm pitch)
Speed Grade -6 (production grade) β€”
Temperature Range Industrial -40C to +100C β€”
RoHS Status [DATA_NEEDED: RoHS status] Compliant (lead-free FBGA)
Protocol Support Gigabit Ethernet, SONET/SDH, PCI Express, custom serial β€”
Logic Array Blocks (LABs) β€” 2,566
Total RAM Bits β€” 1,944,576
User I/O Pins β€” 455
Core Supply Voltage β€” 1.425 V to 1.575 V (1.5 V typical)
Process Technology β€” 130 nm CMOS
Internal Clock Performance β€” Up to 5000 MHz
Mounting Type β€” Surface Mount
Operating Junction Temperature β€” -40C to +100C
Transceiver Count β€” [DATA_NEEDED: precise number of SERDES channels per pin list]
Lead-Free β€” Yes

Datasheets & Resources

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