EP1SGX25F1020C6 vs EP1SGX25DF1020C6 Comparison

Detailed side-by-side comparison of EP1SGX25F1020C6 by Intel and EP1SGX25DF1020C6 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP1SGX25F1020C6 EP1SGX25DF1020C6
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $645.00 $289.00
Family Stratix GX Stratix GX
Logic Elements 25,660 β€”
LABs/CLBs 2,566 β€”
Total RAM Bits 1,944,576 1,944,576
User I/O Pins 607 β€”
Package 1020-ball FineLine BGA (FBGA-1020) β€”
Package Dimensions 33 x 33 mm, 1.0 mm pitch β€”
Core Voltage 1.5 V β€”
Operating Temperature 0C to 85C (commercial) 0 Β°C to +85 Β°C (commercial)
Logic Family CMOS CMOS
Transceivers Up to 20 multi-gigabit channels (this die density supports up to 14 active) Embedded multi-gigabit transceivers (3.125 Gbps class)
Transceiver Data Rate 622 Mbps to 3.1875 Gbps β€”
Mounting Type Surface Mount (BGA) Surface Mount
Lead Free Yes β€”
RoHS Status [DATA_NEEDED: rohs status] Lead-free per datasheet
MSL Level [DATA_NEEDED: msl level] β€”
Device Logic Elements β€” 25,660
LABs / CLBs β€” 2,566
Number of I/O β€” 607 (614 user pins per datasheet)
Core Supply Voltage β€” 1.5 V (1.425 V min, 1.575 V max)
Package Type β€” 1020-BBGA / FC-FBGA
Package Size β€” 33 x 33 mm, 1.0 mm pitch
Process Technology β€” 130 nm CMOS
Configuration Method β€” Passive Serial, Fast Passive Parallel, JTAG

Datasheets & Resources

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