EP1SGX40FF1020C5 vs EP1SGX40DF1020C5ES Comparison
Detailed side-by-side comparison of EP1SGX40FF1020C5 by Intel and EP1SGX40DF1020C5ES by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP1SGX40FF1020C5 | EP1SGX40DF1020C5ES |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,245.00 | $0.00 |
| Family | Stratix GX | β |
| Logic Elements | 41,250 | β |
| Configurable Logic Blocks (CLBs) | 4,125 | β |
| Total RAM Bits | 3,423,744 bits | β |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | β |
| Transceiver Channels | 20 (up to 3.125 Gbps) | β |
| Core Voltage | 1.5 V (1.425 V to 1.575 V) | β |
| Operating Temperature | 0C to +85C (commercial, -C5 speed grade) | 0 C to 85 C |
| Package | 1020-ball FCBGA (FF), 1.00 mm pitch, 33 x 33 mm | β |
| Seated Height | 3.50 mm | β |
| Process Technology | CMOS, 0.13 um | 130 nm |
| Maximum User I/O | [DATA_NEEDED: max user I/O count] | β |
| DSP Blocks | [DATA_NEEDED: DSP block count] | β |
| PLLs | [DATA_NEEDED: PLL count] | β |
| Mounting Type | Surface Mount | β |
| MSL Level | [DATA_NEEDED: MSL rating] | β |
| RoHS Status | [DATA_NEEDED: RoHS status] | unknown |
| Product Type | β | Field-Programmable Gate Array (FPGA) |
| Logic Family | β | Stratix GX |
| Logic Technology | β | CMOS |
| Logic Cells | β | 41,250 cells |
| Logic Array Blocks | β | 4,125 LABs |
| Configurable I/O Connections | β | 624 input and 624 output connections |
| Supply Voltage | β | 1.5 V |
| Reported Maximum Frequency | β | 5,000 MHz |
| Reported Maximum CLB Combinatorial Delay | β | 7.49 ns |
| Alternative Listed Maximum Clock Frequency | β | 6 MHz |
| Terminal Count | β | 1,020 pins |
| Package Type | β | FC-FBGA-1020 |
| Package Dimensions | β | 33 mm x 33 mm |
| Ball Pitch | β | 1 mm |
| Mounting Configuration | β | Surface-mount ball grid array |
| Terminal Form | β | Ball |
| Package Code | β | BGA |
| Configuration Method | β | [DATA_NEEDED: configuration method] |
| REACH Status | β | unknown |
| AEC-Q100 Qualification | β | unknown |