EP20K400FC784-3 vs EP20K400FC784-2 Comparison
Detailed side-by-side comparison of EP20K400FC784-3 by Intel and EP20K400FC784-2 by Altera. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP20K400FC784-3 | EP20K400FC784-2 |
|---|---|---|
| Brand | Intel | Altera |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $175.00 | $175.00 |
| Family | APEX 20K (MultiCore) | APEX 20K |
| Typical Gates | 400,000 | β |
| Maximum System Gates | 1,052,000 | β |
| Logic Elements | 21,168 | 16,640 |
| Maximum RAM Bits | 212,992 | β |
| Embedded System Blocks (ESBs) | 100 | β |
| PLLs | 4 | β |
| User I/O Pins | 488 | β |
| Package | 784-ball FineLine BGA (FC) | 784-Ball FineLine BGA (FC) |
| Speed Grade | -3 | -2 (industrial) |
| Operating Temperature | Commercial (0Β°C to +85Β°C) | [DATA_NEEDED: exact Tj range] |
| I/O Standards | MultiVolt I/O: 1.8V, 2.5V, 3.3V, 5.0V | β |
| Core Voltage | [DATA_NEEDED: core voltage] | 2.5 V |
| Process Technology | 0.18 Β΅m CMOS | 0.22 Β΅m CMOS SRAM |
| Configuration Method | Serial or parallel, SRAM-based | β |
| RoHS Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: not confirmed in provided data] |
| MSL Level | [DATA_NEEDED: MSL rating] | 3 (per Partstack listing) |
| Lead-Free | [DATA_NEEDED: lead-free status] | β |
| Device Family Member | β | EP20K400C |
| Typical System Gates | β | 400,000 |
| Maximum User I/O Pins | β | 488 (784-BGA) |
| Embedded RAM (ESB) | β | 212 Kbits |
| Maximum Block RAM | β | [DATA_NEEDED: block RAM organization per ESB] |
| Maximum Frequency (internal) | β | [DATA_NEEDED: fmax, datasheet-dependent] |
| MultiVolt I/O Voltage | β | 1.8 V / 2.5 V / 3.3 V |
| Supported I/O Standards | β | LVTTL, LVCMOS, PCI, SSTL-2, SSTL-3, GTL+, CTT |
| Configuration Mode | β | Serial / Parallel SRAM-volatile (external PROM required) |
| Mounting Type | β | Surface Mount (BGA) |
| Peak Reflow Temperature | β | 220 Β°C (per Partstack listing) |
| Hot Socketing | β | Supported |
| JTAG / Boundary-Scan | β | IEEE 1149.1 compliant |