EP20K400FI784-3 vs EP20K400FC784-2 Comparison
Detailed side-by-side comparison of EP20K400FI784-3 by Intel and EP20K400FC784-2 by Altera. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP20K400FI784-3 | EP20K400FC784-2 |
|---|---|---|
| Brand | Intel | Altera |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $155.00 | $175.00 |
| Family | APEX 20K | APEX 20K |
| Typical Gate Count | 400,000 gates | β |
| Logic Elements | [DATA_NEEDED: exact LE count] | 16,640 |
| Dedicated Inputs | 4 | β |
| Embedded System Blocks (ESBs) | [DATA_NEEDED: ESB count] | β |
| Maximum User I/O | [DATA_NEEDED: user I/O count] | β |
| Supply Voltage (Nominal) | 2.5 V | β |
| Supply Voltage Range | 2.375 V to 2.625 V | β |
| Speed Grade | -3 (slowest) | -2 (industrial) |
| Operating Temperature | -40 Β°C to +100 Β°C (industrial) | [DATA_NEEDED: exact Tj range] |
| Package | 784-ball PBGA (Fine-pitch BGA) | 784-Ball FineLine BGA (FC) |
| Package Code | BGA | β |
| Package Shape | Square | β |
| Terminal Pitch | 1.000 mm | β |
| Seated Height (max) | 2.7000 mm | β |
| Body Material | Plastic / Epoxy | β |
| MSL Level | 3 | 3 (per Partstack listing) |
| Configuration Method | SRAM (external EPROM required) | β |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| Process Technology | 0.18 Β΅m CMOS SRAM | 0.22 Β΅m CMOS SRAM |
| RoHS Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: not confirmed in provided data] |
| Device Family Member | β | EP20K400C |
| Typical System Gates | β | 400,000 |
| Maximum User I/O Pins | β | 488 (784-BGA) |
| Embedded RAM (ESB) | β | 212 Kbits |
| Maximum Block RAM | β | [DATA_NEEDED: block RAM organization per ESB] |
| Maximum Frequency (internal) | β | [DATA_NEEDED: fmax, datasheet-dependent] |
| Core Voltage | β | 2.5 V |
| MultiVolt I/O Voltage | β | 1.8 V / 2.5 V / 3.3 V |
| Supported I/O Standards | β | LVTTL, LVCMOS, PCI, SSTL-2, SSTL-3, GTL+, CTT |
| Configuration Mode | β | Serial / Parallel SRAM-volatile (external PROM required) |
| Peak Reflow Temperature | β | 220 Β°C (per Partstack listing) |
| Hot Socketing | β | Supported |
| JTAG / Boundary-Scan | β | IEEE 1149.1 compliant |