EP2A15F672C7N vs EP2A25F672C8N Comparison
Detailed side-by-side comparison of EP2A15F672C7N by Intel and EP2A25F672C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2A15F672C7N | EP2A25F672C8N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $171.00 | $205.00 |
| Family | APEX II | APEX II |
| Logic Elements (Cells) | 16,640 | β |
| Embedded Memory Bits | 425,984 | β |
| User I/Os | 492 | 492 |
| Process Technology | 0.15 Β΅m all-layer copper CMOS | β |
| Metal Layers | Up to 8 | β |
| Core Voltage | 1.5 V | β |
| Maximum Internal Frequency | 500 MHz | 333 MHz |
| Speed Grade | -7 | C8 |
| Package | 672-ball FC-FBGA (FineLine BGA) | 672-ball FC-FBGA (FineLine BGA) |
| Operating Temperature | Commercial (0C to +85C) | 0 C to 85 C (commercial) |
| I/O Standards Supported | LVTTL, LVCMOS, SSTL, HSTL, LVDS, LVPECL | β |
| LVDS Data Rate | Up to 1 Gbps (True-LVDS) | β |
| Configuration Methods | JTAG, Passive Serial | β |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| RoHS Status | [DATA_NEEDED: RoHS status] | Compliant |
| Technology Node | β | 0.15 um all-layer copper process |
| System Gates | β | 900,000 |
| Logic Elements / Cells | β | 24,320 |
| Propagation Delay | β | 1.69 ns |
| Package Body Size | β | 27 x 27 mm |
| Ball Pitch | β | 1.0 mm |
| Core Supply Voltage | β | 1.5 V |
| Multi-Gigabit Transceiver Rate | β | Up to 1 Gbps per channel |
| Lead-Free Suffix | β | N (lead-free, Pb-free finish) |