EP2A15F672C9N vs EP2A15F672C7 Comparison
Detailed side-by-side comparison of EP2A15F672C9N by Intel and EP2A15F672C7 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2A15F672C9N | EP2A15F672C7 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $155.00 | $98.00 |
| Logic Family | APEX II (CMOS) | β |
| Series | Altera APEX II (EP2A) | APEX II (EP2A15) |
| Logic Elements / Cells | 16,640 | β |
| Equivalent Gates | 600,000 | β |
| Maximum User I/O Pins | 492 | β |
| Propagation Delay | 1.94 ns | β |
| Internal Operating Frequency (max) | 379 MHz | β |
| Technology Process | 0.15 Β΅m all-layer copper CMOS, up to 8 metal layers | β |
| Core Supply Voltage | 1.5 V | β |
| Package | 672-ball FC-FBGA (27 x 27 mm, 1 mm pitch, FineLine BGA) | 672-ball FineLine BGA (FCBGA) |
| Operating Temperature | 0Β°C to +85Β°C (commercial grade) | Commercial (0Β°C to +85Β°C) |
| Mounting Type | Surface Mount | Surface Mount |
| MSL Level | 3 (per FC-FBGA moisture sensitivity, typical) | β |
| RoHS Status | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| Lead-Free / Halogen-Free | [DATA_NEEDED: lead-free status] | β |
| I/O Speed Grade | Up to 1 Gbps (LVDS) | β |
| Embedded Memory | Embedded dual-port RAM blocks | β |
| Special Blocks | CAM (Content-Addressable Memory), dedicated multipliers, PLLs | β |
| Speed Grade | C9 (fastest commercial grade in the APEX II speed-grade system) | C7 |
| Family | β | APEX II FPGA |
| Logic Elements (LE) | β | 16,640 |
| Total System Gates | β | 425,984 |
| Maximum User I/O | β | 492 |
| Embedded Memory Bits | β | 425,984 |
| Number of Macrocells / Logic Units | β | 16,640 |
| Propagation Delay (tPD) | β | 1.69 ns |
| Core Voltage | β | 1.5 V |
| Process Technology | β | 0.15 Β΅m all-layer copper, up to 8 metal layers |
| High-Speed I/O Standard | β | True-LVDS, LVPECL, PCML, HyperTransport |
| True-LVDS Data Rate | β | 1 Gbps |
| Package Dimensions | β | 27 mm Γ 27 mm, 1.0 mm pitch |