EP2A25F672C8N vs EP2A25F672C9N Comparison

Detailed side-by-side comparison of EP2A25F672C8N by Intel and EP2A25F672C9N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2A25F672C8N EP2A25F672C9N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $205.00 $195.00
Family APEX II APEX II
Technology Node 0.15 um all-layer copper process β€”
System Gates 900,000 Approx. 900000
Logic Elements / Cells 24,320 24320
Maximum Internal Frequency 333 MHz β€”
Propagation Delay 1.69 ns 2.23 ns
User I/Os 492 β€”
Package 672-ball FC-FBGA (FineLine BGA) 672-ball FineLine BGA (F672), 27 Γ— 27 mm, 1.00 mm pitch
Package Body Size 27 x 27 mm β€”
Ball Pitch 1.0 mm β€”
Core Supply Voltage 1.5 V β€”
Speed Grade C8 β€”
Operating Temperature 0 C to 85 C (commercial) 0 Β°C to +85 Β°C (commercial, C9 grade)
Multi-Gigabit Transceiver Rate Up to 1 Gbps per channel β€”
Mounting Type Surface Mount Surface Mount (BGA)
RoHS Status Compliant Compliant (per distributor listings)
Lead-Free Suffix N (lead-free, Pb-free finish) β€”
Maximum User I/O β€” 492
Operating Frequency β€” 236 MHz
Core Supply Voltage (VCCINT) β€” 1.425 V to 1.575 V (nominal 1.5 V)
Process Technology β€” 0.15 Β΅m all-layer copper, up to 8 metal layers
Seated Height (max) β€” 2.100 mm
Logic Family β€” CMOS
I/O Standards Supported β€” LVTTL, LVCMOS, PCI, GTL+, SSTL-2/3, LVDS, LVPECL, PCML, HyperTransport
LVDS Data Rate β€” Up to 1 Gbps (True-LVDS)
Configuration Interface β€” Serial / Parallel PROM, JTAG, passive parallel (enhanced)
Embedded Memory β€” Enhanced System Blocks (ESBs) for dual-port RAM
Design Software β€” Quartus II (v5.1 or later)

Datasheets & Resources

Browse All Products Create BOM Request Quote