EP2A25F672C9N vs EP2A25F672C7N Comparison
Detailed side-by-side comparison of EP2A25F672C9N by Intel and EP2A25F672C7N by Altera. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2A25F672C9N | EP2A25F672C7N |
|---|---|---|
| Brand | Intel | Altera |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $195.00 | $195.00 |
| Family | APEX II | APEX II |
| Logic Elements / Cells | 24320 | β |
| System Gates | Approx. 900000 | Approximately 900,000 |
| Maximum User I/O | 492 | β |
| Operating Frequency | 236 MHz | β |
| Core Supply Voltage (VCCINT) | 1.425 V to 1.575 V (nominal 1.5 V) | β |
| Process Technology | 0.15 Β΅m all-layer copper, up to 8 metal layers | 0.15 Β΅m all-layer copper (up to 8 metal layers) |
| Package | 672-ball FineLine BGA (F672), 27 Γ 27 mm, 1.00 mm pitch | β |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| Seated Height (max) | 2.100 mm | β |
| Propagation Delay | 2.23 ns | β |
| Logic Family | CMOS | CMOS |
| Operating Temperature | 0 Β°C to +85 Β°C (commercial, C9 grade) | 0 Β°C to 85 Β°C (commercial) |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, GTL+, SSTL-2/3, LVDS, LVPECL, PCML, HyperTransport | β |
| LVDS Data Rate | Up to 1 Gbps (True-LVDS) | β |
| Configuration Interface | Serial / Parallel PROM, JTAG, passive parallel (enhanced) | β |
| Embedded Memory | Enhanced System Blocks (ESBs) for dual-port RAM | Embedded System Blocks (ESB) configurable as dual-port RAM/ROM |
| Design Software | Quartus II (v5.1 or later) | β |
| RoHS Status | Compliant (per distributor listings) | [DATA_NEEDED: RoHS compliance] |
| Logic Elements | β | 24,320 cells |
| User I/Os | β | 492 |
| Propagation Delay (tPD) | β | 1.69 ns |
| Internal Operating Frequency | β | Up to 500 MHz |
| Core Voltage (VCCINT) | β | 1.5 V |
| Package Type | β | 672-ball FC-FBGA (FineLine BGA) |
| Package Body Size | β | 27 x 27 mm |
| Ball Pitch | β | 1.0 mm |
| High-Speed I/O Support | β | True-LVDS, LVPECL, PCML, HyperTransport up to 1 Gbps |
| Programmable Logic Type | β | Loadable PLD (in-system programmable) |
| PLLs | β | Up to 4 |