EP2A40F672I-9 vs EP2A40F672C9N Comparison
Detailed side-by-side comparison of EP2A40F672I-9 by Intel and EP2A40F672C9N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2A40F672I-9 | EP2A40F672C9N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $165.00 | $295.00 |
| Family | APEX II | APEX II |
| Device | EP2A40 | β |
| Logic Elements | 38,400 | 38,400 |
| System Gates | 1,500,000 | 1,500,000 |
| Maximum Operating Frequency | 366 MHz | β |
| Process Technology | 0.15 Β΅m CMOS | 0.15 Β΅m all-layer copper, up to 8 metal layers |
| Core Voltage (VCCINT) | 1.5 V | β |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (banked) | β |
| Operating Temperature | -40 Β°C to +100 Β°C (Industrial) | 0 Β°C to +85 Β°C (commercial) |
| Package | 672-pin FC-FBGA (Fine-pitch Ball Grid Array) | BGA-672 (27 x 27 mm, 1.0 mm pitch) |
| Speed Grade | -9 | C9 (~1.55 ns propagation delay) |
| True-LVDS Channels | Yes (dedicated) | β |
| Embedded Memory | Dual-port RAM, single-port RAM, ROM, CAM (via ESBs) | β |
| Hot Socketing | Supported | β |
| Configuration Mode | Passive serial, passive parallel synchronous, passive parallel asynchronous, JTAG | β |
| Moisture Sensitivity Level | MSL 3 | β |
| Peak Reflow Temperature | 220 Β°C | β |
| RoHS Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status] |
| Device Name | β | EP2A40 |
| User I/Os | β | 492 |
| Embedded RAM (ESB) | β | [DATA_NEEDED: ESB total RAM bits] |
| Package Code | β | FC-FBGA / PBGA672 |
| Core Voltage | β | 1.5 V |
| Internal Frequency | β | 366 MHz |
| LVDS Data Rate | β | 1 Gbps |
| Propagation Delay | β | 1.55 ns |
| Mounting Type | β | Surface Mount |
| Logic Family | β | CMOS (SRAM-based configuration) |