EP2A40FB724C8 vs EP2A40B724C8 Comparison
Detailed side-by-side comparison of EP2A40FB724C8 by Intel and EP2A40B724C8 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2A40FB724C8 | EP2A40B724C8 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Last_time_buy |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $205.00 | $615.00 |
| Family | APEX II | APEX II |
| Device Logic Elements | 38,400 | β |
| Typical Gates | 40,000 | β |
| Total RAM Bits | 655,360 | 655360 |
| User I/O Pins | 540 | β |
| Core Voltage | 1.425 V to 1.575 V | β |
| Package | 724-BGA (FCBGA), 35 mm x 35 mm | β |
| Speed Grade | -8 | β |
| Operating Temperature | Commercial (0 C to +85 C) per suffix | 0 Β°C to 85 Β°C (TJ) |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| Architecture | MultiCore (LUT + Embedded System Blocks) | β |
| Embedded System Blocks | Configurable dual-port SRAM / CAM / FIFO | β |
| Configuration Mode | JTAG / Passive Serial / Passive Parallel | β |
| RoHS Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status per datasheet] |
| Process Technology | CMOS, SRAM-based | 0.15 Β΅m CMOS, all-layer copper, up to 8 metal layers |
| Device Logic Elements / Cells | β | 38400 |
| Total System Gates | β | ~1.5 M |
| Number of I/O | β | 540 |
| Number of Logic Gates | β | [DATA_NEEDED: exact gate count in cells vs system gates] |
| Core Supply Voltage | β | 1.5 V (1.425 V to 1.575 V) |
| Maximum Internal Frequency | β | 376 MHz |
| I/O Standards Supported | β | True-LVDS, LVPECL, PCML, HyperTransport (up to 1 Gbps) |
| Package / Case | β | 724-BBGA, FCBGA (35 x 35 mm) |
| Supplier Device Package | β | 724-BGA |
| Shipping Media | β | Tray |
| Moisture Sensitivity Level (MSL) | β | [DATA_NEEDED: MSL level per JEDEC J-STD-020] |