EP2AGX125EF35C4G vs EP2AGX125EF35I3G Comparison

Detailed side-by-side comparison of EP2AGX125EF35C4G by Intel and EP2AGX125EF35I3G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EP2AGX125EF35C4G EP2AGX125EF35C4G - Arria II GX FPGA, 118K LEs, 1152-FCBGA | Intel

EP2AGX125EF35C4G - Arria II GX FPGA, 118K LEs, 1152-FCBGA | Intel

EP2AGX125EF35C4G ⚠ Last Time Buy
Intel
EP2AGX125EF35I3G EP2AGX125EF35I3G - Arria II GX FPGA, 118K LE, 452 I/O | Intel

EP2AGX125EF35I3G - Arria II GX FPGA, 118K LE, 452 I/O | Intel

EP2AGX125EF35I3G ⚠ Last Time Buy

Specification Comparison

Parameter EP2AGX125EF35C4G EP2AGX125EF35I3G
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Last_time_buy Last_time_buy
Stock Status In Stock In Stock
Unit Price (USD) $1,290.00 $410.39
Family Arria II GX β€”
Logic Elements 118,143 118143 LE
Embedded Memory Bits 8,315,904 β€”
Memory Blocks (M9K) [DATA_NEEDED: M9K count] β€”
Hardware Multipliers (18x18) 452 β€”
DSP Blocks [DATA_NEEDED: DSP block count] β€”
Transceiver Channels 12 β€”
Maximum Transceiver Data Rate 6.375 Gbps β€”
PCI Express Hard IP Gen1/Gen2 x1/x4/x8 β€”
Core Voltage 0.9 V β€”
User I/O Banks [DATA_NEEDED: I/O bank count] β€”
Maximum User I/O [DATA_NEEDED: max user I/O count] β€”
Process Technology 40 nm β€”
Package 1152-ball FC-FBGA (Flip-Chip) β€”
Operating Temperature 0C to +85C (Commercial) -40C to +100C (Industrial)
Mounting Type Surface Mount β€”
Configuration Method SRAM-based, PS/FPP/JTAG β€”
RoHS Status Compliant Compliant
Speed Grade C4 I3
Lead-Free Yes β€”
Series β€” Arria II GX
Adaptive Logic Modules (ALMs) β€” 49640 ALM
Embedded Memory β€” 7.93 Mbit
Total RAM Bits β€” 8315904 bit
Number of I/O β€” 452
Package / Case β€” 1152-BBGA, FCBGA
Mounting Style β€” SMD/SMT
Process Node β€” 40 nm
Packaging β€” Tray
Lead Free β€” Yes
Transceivers β€” Up to 8 SERDES channels (per family)

Datasheets & Resources

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