EP2AGX45CU17I3G vs EP2AGX45DF25C4G Comparison
Detailed side-by-side comparison of EP2AGX45CU17I3G by Intel and EP2AGX45DF25C4G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2AGX45CU17I3G | EP2AGX45DF25C4G |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $445.00 | $205.00 |
| Family | Arria II GX | EP2AGX (Arria II GX) |
| Logic Elements | 42,959 | 45000 |
| Logic Array Blocks (LABs) | 1,805 | β |
| Total RAM Bits | 3,517,440 | β |
| User I/O Pins | 156 | β |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | β |
| Transceivers | Up to 8 channels | [DATA_NEEDED: transceiver count and data rate] |
| Transceiver Data Rate | Up to 3.125 Gbps | β |
| Process Technology | 40 nm | β |
| Core Voltage (Vcc) | 1.0 V (0.9 V internal) | β |
| PLLs | 4 | β |
| DSP Blocks | Yes (variable-precision DSP) | [DATA_NEEDED: DSP block count for EP2AGX45] |
| Operating Temperature | -40C to +100C (Industrial) | β |
| Package | 358-ball UBGA (FCBGA), 17x17 mm | 572-BGA, FCBGA |
| Ball Pitch | 1.0 mm | β |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| MSL Level | 3 (168 hours) | β |
| RoHS Status | Compliant | β |
| Series | β | Arria II GX |
| Embedded Memory Bits | β | 3517440 |
| Adaptive Logic Modules | β | 42959 |
| Number of I/O | β | 252 |
| Package Code | β | DF25 (1.0 mm pitch) |
| Speed Grade | β | C4 (-4 speed grade) |
| Process Node | β | 40 nm |
| Lead Free / RoHS | β | Yes (suffix G = lead-free) |
| User I/O Banks | β | [DATA_NEEDED: number of I/O banks] |