EP2AGZ225FF35I3N vs EP2AGZ225FF35I4G Comparison
Detailed side-by-side comparison of EP2AGZ225FF35I3N by Intel and EP2AGZ225FF35I4G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2AGZ225FF35I3N | EP2AGZ225FF35I4G |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $2,655.00 | $1,450.00 |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements (LE) | 224,000 | β |
| Embedded Memory | 14,248,960 bits (approx. 14.25 Mbit) | Yes (per Arria II GZ family) |
| Logic Array Blocks (LABs) | 8,960 | β |
| User I/O Count | 554 | β |
| Maximum Transceiver Data Rate | 6.375 Gbps | β |
| Transceiver Channels | 24 | β |
| Process Technology | 40 nm | β |
| Core Voltage | 0.9 V | β |
| Operating Temperature | -40C to +100C (Industrial) | β |
| Package | 1152-ball FC-FBGA | β |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| MSL Level | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: moisture sensitivity level] |
| RoHS Status | [DATA_NEEDED: RoHS status] | Compliant (per distributor listing) |
| Configuration Method | SRAM-based (volatile, requires external config device) | β |
| Maximum User I/O | 554 | β |
| Logic Elements | β | ~224,000 LE |
| Process Node | β | 40 nm |
| Number of I/O | β | 554 user I/O |
| Package Type | β | 1152-ball FineLine BGA (FBGA) |
| Package Code | β | FF35 |
| Operating Temperature Grade | β | Industrial (-40C to +100C) |
| Speed Grade | β | I4 |
| Supply Voltage | β | [DATA_NEEDED: core VCC voltage] |
| Embedded Transceivers | β | Multi-gigabit (per datasheet) |
| DSP Blocks | β | Yes (per Arria II GZ family) |
| PCI Express Hard IP | β | Yes (Gen1/Gen2) |
| External Memory Interface | β | DDR3 controller (per family) |
| Lead-Free | β | Yes (per distributor listing) |