EP2AGZ300FH29C4G vs EP2AGZ300FH29I4G Comparison

Detailed side-by-side comparison of EP2AGZ300FH29C4G by Intel and EP2AGZ300FH29I4G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2AGZ300FH29C4G EP2AGZ300FH29I4G
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $1,700.00 $1,350.00
Series Arria II GZ β€”
Logic Elements 300,000 (approx.) β€”
Number of LABs/CLBs [DATA_NEEDED: LAB count] β€”
Total RAM Bits [DATA_NEEDED: embedded memory bits] β€”
Number of I/O [DATA_NEEDED: max user I/O count] 281
Number of Transceivers [DATA_NEEDED: transceiver count and rate] β€”
Number of Multipliers (18x18) [DATA_NEEDED: DSP block count] β€”
Voltage - Supply [DATA_NEEDED: core and I/O supply rails] β€”
Operating Temperature 0C to +85C (commercial grade, suffix C) β€”
Grade C4 (commercial, speed grade 4) β€”
Mounting Type Surface Mount Surface Mount (BGA)
Package / Case 780-BGA (Fine-pitch BGA, FH29) β€”
MSL Level [DATA_NEEDED: MSL moisture sensitivity level] [DATA_NEEDED: MSL rating]
RoHS Status Compliant Compliant
Process Technology 40 nm β€”
Lead-Free Yes Yes (per RoHS)
Manufacturer Intel (formerly Altera) β€”
Family β€” Arria II GZ (AGZ)
Logic Elements (LE) β€” 300,000 (approx., per family member)
Package Type β€” 780-ball Flip-Chip BGA (FineLine)
Package Code β€” FH29 (29x29 mm)
Operating Temperature Range β€” -40C to +100C (industrial, I-grade)
Speed Grade β€” I4
Process Node β€” 40 nm TSMC
Supply Voltage (Core) β€” 0.9 V (typical)
Configuration Method β€” JTAG / Passive Serial / Fast Passive Parallel
Transceivers β€” Embedded multi-gigabit transceivers (per family)
DSP Blocks β€” Yes (variable-precision, per family)
Block RAM β€” Embedded M9K / M144K blocks

Datasheets & Resources

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