EP2AGZ300FH29C4N vs EP2AGZ300FH29I4G Comparison
Detailed side-by-side comparison of EP2AGZ300FH29C4N by Intel and EP2AGZ300FH29I4G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2AGZ300FH29C4N | EP2AGZ300FH29I4G |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,395.00 | $1,350.00 |
| Family | Arria II GZ | Arria II GZ (AGZ) |
| Logic Elements (LE) | 298,000 | 300,000 (approx., per family member) |
| Logic Array Blocks (LABs) | 11,920 | β |
| Adaptive Logic Modules (ALMs) | 119,200 | β |
| Embedded Memory (bits) | 18,854,912 | β |
| User I/O Pins | 281 | β |
| DSP Blocks | [DATA_NEEDED: exact DSP block count for EP2AGZ300] | Yes (variable-precision, per family) |
| Transceivers | Up to 28 (up to 6.375 Gbps) | Embedded multi-gigabit transceivers (per family) |
| Core Voltage | 0.9 V | β |
| Process Node | 40 nm | 40 nm TSMC |
| Package | 780-ball FC-HFBGA (FH29) | β |
| Speed Grade | C4 | I4 |
| Temperature Grade | Industrial (N suffix) | β |
| Mounting Type | Surface Mount (BGA) | Surface Mount (BGA) |
| RoHS Status | Compliant | Compliant |
| Number of I/O | β | 281 |
| Package Type | β | 780-ball Flip-Chip BGA (FineLine) |
| Package Code | β | FH29 (29x29 mm) |
| Operating Temperature Range | β | -40C to +100C (industrial, I-grade) |
| Supply Voltage (Core) | β | 0.9 V (typical) |
| Configuration Method | β | JTAG / Passive Serial / Fast Passive Parallel |
| Block RAM | β | Embedded M9K / M144K blocks |
| MSL Level | β | [DATA_NEEDED: MSL rating] |
| Lead-Free | β | Yes (per RoHS) |