EP2AGZ300FH29I3N vs EP2AGZ300FH29I4G Comparison
Detailed side-by-side comparison of EP2AGZ300FH29I3N by Intel and EP2AGZ300FH29I4G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP2AGZ300FH29I3N - 298K LE Arria II GZ FPGA 780-FCBGA | Intel
EP2AGZ300FH29I3N β End of Life
Specification Comparison
| Parameter | EP2AGZ300FH29I3N | EP2AGZ300FH29I4G |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Eol | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,380.00 | $1,350.00 |
| Family | Arria II GZ | Arria II GZ (AGZ) |
| Logic Elements | 298,000 | β |
| Logic Array Blocks (LABs) | 11,920 | β |
| Embedded Memory | 18,854,912 bits | β |
| User I/O Pins | 281 | β |
| Transceivers | 12 | Embedded multi-gigabit transceivers (per family) |
| Max Transceiver Speed | 6.375 Gbps | β |
| Process Node | 40 nm | 40 nm TSMC |
| Core Voltage | 0.9 V | β |
| Package | 780-FCBGA (H-BGA, 29x29 mm) | β |
| Speed Grade | I3 | I4 |
| Operating Temperature | -40C to +100C (Industrial) | β |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| PLLs | 8 (4 general-purpose + 4 transceiver) | β |
| Global Clock Networks | 16 | β |
| RoHS Status | Compliant | Compliant |
| Lifecycle Status | End of Life (EOL) | β |
| Logic Elements (LE) | β | 300,000 (approx., per family member) |
| Number of I/O | β | 281 |
| Package Type | β | 780-ball Flip-Chip BGA (FineLine) |
| Package Code | β | FH29 (29x29 mm) |
| Operating Temperature Range | β | -40C to +100C (industrial, I-grade) |
| Supply Voltage (Core) | β | 0.9 V (typical) |
| Configuration Method | β | JTAG / Passive Serial / Fast Passive Parallel |
| DSP Blocks | β | Yes (variable-precision, per family) |
| Block RAM | β | Embedded M9K / M144K blocks |
| MSL Level | β | [DATA_NEEDED: MSL rating] |
| Lead-Free | β | Yes (per RoHS) |