EP2AGZ300FH29I4G vs EP2AGZ300FH29C4G Comparison
Detailed side-by-side comparison of EP2AGZ300FH29I4G by Intel and EP2AGZ300FH29C4G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2AGZ300FH29I4G | EP2AGZ300FH29C4G |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,350.00 | $1,700.00 |
| Family | Arria II GZ (AGZ) | β |
| Logic Elements (LE) | 300,000 (approx., per family member) | β |
| Number of I/O | 281 | [DATA_NEEDED: max user I/O count] |
| Package Type | 780-ball Flip-Chip BGA (FineLine) | β |
| Package Code | FH29 (29x29 mm) | β |
| Operating Temperature Range | -40C to +100C (industrial, I-grade) | β |
| Speed Grade | I4 | β |
| Process Node | 40 nm TSMC | β |
| Supply Voltage (Core) | 0.9 V (typical) | β |
| Configuration Method | JTAG / Passive Serial / Fast Passive Parallel | β |
| Transceivers | Embedded multi-gigabit transceivers (per family) | β |
| DSP Blocks | Yes (variable-precision, per family) | β |
| Block RAM | Embedded M9K / M144K blocks | β |
| RoHS Status | Compliant | Compliant |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| MSL Level | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL moisture sensitivity level] |
| Lead-Free | Yes (per RoHS) | Yes |
| Series | β | Arria II GZ |
| Logic Elements | β | 300,000 (approx.) |
| Number of LABs/CLBs | β | [DATA_NEEDED: LAB count] |
| Total RAM Bits | β | [DATA_NEEDED: embedded memory bits] |
| Number of Transceivers | β | [DATA_NEEDED: transceiver count and rate] |
| Number of Multipliers (18x18) | β | [DATA_NEEDED: DSP block count] |
| Voltage - Supply | β | [DATA_NEEDED: core and I/O supply rails] |
| Operating Temperature | β | 0C to +85C (commercial grade, suffix C) |
| Grade | β | C4 (commercial, speed grade 4) |
| Package / Case | β | 780-BGA (Fine-pitch BGA, FH29) |
| Process Technology | β | 40 nm |
| Manufacturer | β | Intel (formerly Altera) |