EP2AGZ300FH29I4G vs EP2AGZ300FH29C4N Comparison

Detailed side-by-side comparison of EP2AGZ300FH29I4G by Intel and EP2AGZ300FH29C4N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2AGZ300FH29I4G EP2AGZ300FH29C4N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $1,350.00 $1,395.00
Family Arria II GZ (AGZ) Arria II GZ
Logic Elements (LE) 300,000 (approx., per family member) 298,000
Number of I/O 281 β€”
Package Type 780-ball Flip-Chip BGA (FineLine) β€”
Package Code FH29 (29x29 mm) β€”
Operating Temperature Range -40C to +100C (industrial, I-grade) β€”
Speed Grade I4 C4
Process Node 40 nm TSMC 40 nm
Supply Voltage (Core) 0.9 V (typical) β€”
Configuration Method JTAG / Passive Serial / Fast Passive Parallel β€”
Transceivers Embedded multi-gigabit transceivers (per family) Up to 28 (up to 6.375 Gbps)
DSP Blocks Yes (variable-precision, per family) [DATA_NEEDED: exact DSP block count for EP2AGZ300]
Block RAM Embedded M9K / M144K blocks β€”
RoHS Status Compliant Compliant
Mounting Type Surface Mount (BGA) Surface Mount (BGA)
MSL Level [DATA_NEEDED: MSL rating] β€”
Lead-Free Yes (per RoHS) β€”
Logic Array Blocks (LABs) β€” 11,920
Adaptive Logic Modules (ALMs) β€” 119,200
Embedded Memory (bits) β€” 18,854,912
User I/O Pins β€” 281
Core Voltage β€” 0.9 V
Package β€” 780-ball FC-HFBGA (FH29)
Temperature Grade β€” Industrial (N suffix)

Datasheets & Resources

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