EP2AGZ300FH29I4G vs EP2AGZ300FH29I4N Comparison

Detailed side-by-side comparison of EP2AGZ300FH29I4G by Intel and EP2AGZ300FH29I4N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2AGZ300FH29I4G EP2AGZ300FH29I4N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $1,350.00 $1,380.00
Family Arria II GZ (AGZ) Arria II GZ
Logic Elements (LE) 300,000 (approx., per family member) β€”
Number of I/O 281 β€”
Package Type 780-ball Flip-Chip BGA (FineLine) β€”
Package Code FH29 (29x29 mm) BGA / FC-HFBGA
Operating Temperature Range -40C to +100C (industrial, I-grade) β€”
Speed Grade I4 β€”
Process Node 40 nm TSMC β€”
Supply Voltage (Core) 0.9 V (typical) β€”
Configuration Method JTAG / Passive Serial / Fast Passive Parallel β€”
Transceivers Embedded multi-gigabit transceivers (per family) β€”
DSP Blocks Yes (variable-precision, per family) β€”
Block RAM Embedded M9K / M144K blocks β€”
RoHS Status Compliant Compliant
Mounting Type Surface Mount (BGA) Surface Mount
MSL Level [DATA_NEEDED: MSL rating] β€”
Lead-Free Yes (per RoHS) Yes
Logic Elements β€” 298,000
Logic Array Blocks (LABs) β€” 11,920
Embedded Memory Bits β€” 18,854,912
User I/Os β€” 281
Operating Frequency (max) β€” 500 MHz
Process Technology β€” 40 nm CMOS
Core Supply Voltage β€” 0.9 V
Package β€” 780-ball FCBGA (FH29)
Operating Temperature Grade β€” Industrial (I4 speed/temperature grade)
Number of Cells β€” 298,000

Datasheets & Resources

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