EP2AGZ300HF40C3G vs EP2AGZ300HF40I3N Comparison
Detailed side-by-side comparison of EP2AGZ300HF40C3G by Intel and EP2AGZ300HF40I3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2AGZ300HF40C3G | EP2AGZ300HF40I3N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $5,950.00 | $3,820.00 |
| Series | Arria II GZ | Arria II GZ |
| Manufacturer | Intel (formerly Altera) | β |
| Logic Elements (LE) | 300,000 | 298,000 |
| User I/O Count | 734 | 734 |
| Package | 1517-ball FBGA | 1517-BBGA, FCBGA (HF40) |
| Speed Grade | C3 (commercial) | β |
| Lead Finish | Pb-free (G suffix) | β |
| Operating Temperature | Commercial (0C to +85C) | β |
| Embedded Memory | Approx. 18.7 Mbits | β |
| DSP Blocks | 800+ (18x18 multipliers) | β |
| Multi-Gigabit Transceivers | 24 (up to 6.375 Gbps) | β |
| PLLs | 8 | β |
| Hard Memory Controllers | DDR3, QDRII+, RLDRAM II | β |
| PCIe Hard IP | PCIe Gen2 (x1/x4/x8) | β |
| Process Technology | 40 nm TSMC | 40 nm |
| Configuration Method | Serial/Parallel, partial reconfiguration supported | β |
| RoHS Status | Pb-free finish - compliant | Compliant |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| Family | β | EP2AGZ |
| Embedded Memory Bits | β | 18,854,912 |
| Ball Pitch | β | 1.0 mm |
| Supply Voltage (Core) | β | 0.9 V |
| Operating Temperature Grade | β | Industrial (-40C to +100C) |
| Number of PLLs | β | 4 |
| Configuration Interface | β | Passive Serial / Fast Passive Parallel / JTAG |
| Bitstream Encryption | β | AES-256 |