EP2AGZ300HF40I4 vs EP2AGZ300HF40I3N Comparison
Detailed side-by-side comparison of EP2AGZ300HF40I4 by Intel and EP2AGZ300HF40I3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2AGZ300HF40I4 | EP2AGZ300HF40I3N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,925.00 | $3,820.00 |
| Series | Arria II GZ | Arria II GZ |
| Family | Field-Programmable Gate Array (FPGA) | EP2AGZ |
| Manufacturer | Intel (formerly Altera) | β |
| Process Node | 40 nm | β |
| Logic Elements | 298,000 | β |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | β |
| Embedded Memory | 18,854,912 bits (18.85 Mbit) | β |
| Block RAM | 19,200 Kbits | β |
| Number of Logic Cells | 298,000 | β |
| Maximum User I/O Pins | 1192 | β |
| Number of Transceivers | Up to 24 | β |
| Transceiver Data Rate (max) | 6.375 Gbps (CPRI/OBSAI) | β |
| Number of PLLs | 8 | 4 |
| Core Voltage | 0.9 V (1.1 V option via SmartVoltage IDM) | β |
| Core Performance (max) | 500 MHz | β |
| Number of Global Clock Networks | 16 | β |
| Package Type | 1517-ball FC-FBGA | β |
| Operating Temperature Grade | Industrial (I4): -40C to +100C | Industrial (-40C to +100C) |
| Mounting Type | Surface Mount (Flip-Chip BGA) | Surface Mount |
| RoHS Status | Compliant | Compliant |
| Lead-Free | Yes | β |
| Logic Elements (LE) | β | 298,000 |
| Embedded Memory Bits | β | 18,854,912 |
| User I/O Count | β | 734 |
| Package | β | 1517-BBGA, FCBGA (HF40) |
| Ball Pitch | β | 1.0 mm |
| Supply Voltage (Core) | β | 0.9 V |
| Process Technology | β | 40 nm |
| Configuration Interface | β | Passive Serial / Fast Passive Parallel / JTAG |
| Bitstream Encryption | β | AES-256 |