EP2AGZ350FH29C3G vs EP2AGZ300FH29C3G Comparison
Detailed side-by-side comparison of EP2AGZ350FH29C3G by Intel and EP2AGZ300FH29C3G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2AGZ350FH29C3G | EP2AGZ300FH29C3G |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,350.00 | $1,545.00 |
| Logic Elements | 350,000 | 300,000 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | β |
| Embedded Memory (Bits) | 16,402,944 | β |
| Embedded Memory Blocks | [DATA_NEEDED: M9K/M144K block count] | β |
| User I/O Pins | 281 | β |
| Transceivers | 24 channels | Yes (multi-gigabit) |
| Transceiver Data Rate (max) | 8.5 Gbps | β |
| PCI Express Hard IP | 4 x PCIe Gen2 (x1/x4) | β |
| External Memory Interface | DDR3 up to 800 MHz, DDR2, QDRII+ | β |
| PLLs | 8 (4 enhanced, 4 fast) | β |
| Global Clocks | 16 | β |
| Process Node | 40 nm TSMC | 40 nm |
| Speed Grade | C3 (commercial, slowest) | 3 |
| Operating Junction Temperature | 0C to +85C | β |
| Package | 780-ball FBGA (HBGA, 29x29 mm) | 780-BGA (HBGA, 29 mm) |
| Mounting Type | Surface Mount | Surface Mount |
| RoHS Status | Compliant | Compliant |
| Lead-Free | Yes | β |
| MSL Level | [DATA_NEEDED: MSL rating] | 3 (per JEDEC J-STD-020, where stated) |
| Series | β | Arria II GZ |
| Manufacturer | β | Intel (Altera) |
| Number of I/O | β | 281 |
| Operating Temperature | β | 0C to +85C (commercial, speed grade 3) |
| Supply Voltage (Core) | β | [DATA_NEEDED: core voltage] |
| Embedded Memory | β | M9K / M144K block RAM |
| DSP Blocks | β | Yes (variable-precision DSP) |