EP2AGZ350FH29C3G vs EP2AGZ350FH29I3G Comparison

Detailed side-by-side comparison of EP2AGZ350FH29C3G by Intel and EP2AGZ350FH29I3G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2AGZ350FH29C3G EP2AGZ350FH29I3G
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $1,350.00 $1,450.00
Logic Elements 350,000 β€”
Adaptive Logic Modules (ALMs) [DATA_NEEDED: ALM count] β€”
Embedded Memory (Bits) 16,402,944 β€”
Embedded Memory Blocks [DATA_NEEDED: M9K/M144K block count] β€”
User I/O Pins 281 β€”
Transceivers 24 channels Multi-gigabit transceivers (family supports up to 16 channels at up to 6.375 Gbps per family datasheet)
Transceiver Data Rate (max) 8.5 Gbps β€”
PCI Express Hard IP 4 x PCIe Gen2 (x1/x4) β€”
External Memory Interface DDR3 up to 800 MHz, DDR2, QDRII+ β€”
PLLs 8 (4 enhanced, 4 fast) β€”
Global Clocks 16 β€”
Process Node 40 nm TSMC 40 nm
Speed Grade C3 (commercial, slowest) β€”
Operating Junction Temperature 0C to +85C β€”
Package 780-ball FBGA (HBGA, 29x29 mm) 780-FBGA (FineLine BGA, FH29)
Mounting Type Surface Mount Surface Mount
RoHS Status Compliant Compliant
Lead-Free Yes β€”
MSL Level [DATA_NEEDED: MSL rating] 3 (per BGA package handling guidelines)
Family β€” Arria II GZ
Logic Elements (LE) β€” 350000 (approximately)
User I/O Count β€” 281
Temperature Grade β€” Industrial (-40C to +100C)
Operating Temperature Range β€” -40C to +100C
Supply Voltage Core β€” [DATA_NEEDED: VCC core voltage]
Memory Interface β€” DDR3 with read/write leveling support (family feature)
Embedded Multipliers β€” 18x18 hardware multipliers (family feature)
Configuration Method β€” Serial or parallel via Quartus II (family feature)
Lead Free β€” Yes
Halogen Free β€” [DATA_NEEDED: halogen free status]

Datasheets & Resources

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