EP2C70F896C6 vs EP2C70F672C7N Comparison
Detailed side-by-side comparison of EP2C70F896C6 by Intel and EP2C70F672C7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2C70F896C6 | EP2C70F672C7N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Last_time_buy | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $650.00 | $195.00 |
| Family | Cyclone II | Cyclone II |
| Logic Elements | 68,416 | β |
| Total Memory Bits | 1,152,000 | 1,152,000 |
| M9K Memory Blocks | 622 | β |
| Embedded 18x18 Multipliers | 150 | β |
| PLLs | 4 | 4 |
| Maximum User I/O | 622 (per DigiKey listing) | 422 |
| Maximum Operating Frequency | 500 MHz | β |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Voltage | 1.2 V | β |
| Package | 896-ball FBGA (FineLine BGA) | 672-BGA (FBGA-672) |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| Configuration Modes | Active Serial, Passive Serial, JTAG | β |
| Operating Temperature Grade | Commercial (0C to +85C) inferred from speed grade suffix | β |
| Speed Grade | 6 | C7 (slower, lower-power variant) |
| RoHS Status | [DATA_NEEDED: confirmed RoHS compliance status] | Compliant (lead-free FBGA) |
| Logic Elements (LE) | β | 68,416 |
| Embedded Multipliers (18x18) | β | 150 |
| User I/O Banks | β | 8 |
| Operating Temperature | β | 0C to +85C (Commercial) |
| Supply Voltage - Core | β | 1.15 V to 1.25 V (internal) |
| Supply Voltage - I/O | β | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-standard) |
| MSL Level | β | 3 (per JEDEC J-STD-020) |
| Configuration Method | β | Serial (AS) or Parallel (PS) via Altera EPCS/EPC configuration devices |