EP2S130F1020C3 vs EP2S180F1020C3 Comparison

Detailed side-by-side comparison of EP2S130F1020C3 by Intel and EP2S180F1020C3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2S130F1020C3 EP2S180F1020C3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $1,295.00 $1,280.00
Series Stratix II Stratix II
Family Stratix II β€”
Logic Elements / Cells 132,540 β€”
Logic Array Blocks (LABs) 6,627 8,970
User I/Os 742 β€”
Embedded Memory (TriMatrix) [DATA_NEEDED: total Mbits] β€”
DSP / Multiplier Blocks [DATA_NEEDED: DSP block count] β€”
Transceivers Logic-rich SKU (no transceiver; transceiver variants use different suffix) β€”
Maximum Internal Frequency 778.82 MHz (per family datasheet) β€”
Process Technology 90 nm β€”
Core Supply Voltage (VCCINT) 1.15 V to 1.25 V β€”
Package / Case 1020-BBGA (FC-FBGA), 33x33 mm β€”
Supplier Device Package 1020-FBGA (33x33) β€”
Mounting Type Surface Mount Surface Mount
Operating Temperature 0C to +85C (commercial, 'C' speed grade) Commercial (0C to +85C)
Speed Grade C3 (commercial, -3 speed) C3
RoHS Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
MSL Level [DATA_NEEDED: MSL level] β€”
Device Family β€” EP2S180
Equivalent Logic Elements (LEs) β€” 179,400
Embedded Memory (RAM bits) β€” 9,383,040
Maximum User I/Os β€” 742
Package β€” 1020-ball FBGA (flip-chip BGA)
Process Node β€” 90 nm, all-layer copper SRAM
Core Voltage β€” 1.2 V
DSP Blocks β€” Dedicated high-speed multipliers
Memory Interfaces Supported β€” DDR2 SDRAM, QDRII SRAM, RLDRAM II
I/O Standards β€” LVDS, LVPECL, SSTL, HSTL
Configuration Method β€” SRAM-based (volatile, requires boot device)
Development Toolchain β€” Quartus II / Quartus Prime

Datasheets & Resources

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