EP2S130F1020C3NGA vs EP2S180F1020C3 Comparison
Detailed side-by-side comparison of EP2S130F1020C3NGA by Intel and EP2S180F1020C3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2S130F1020C3NGA | EP2S180F1020C3 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,395.00 | $1,280.00 |
| Family | Stratix II | β |
| Logic Elements (LE) | 132,540 | β |
| Logic Array Blocks (LABs) | 6,627 | 8,970 |
| Embedded Memory (TriMatrix) | 6,747,840 bits (6.7 Mbits) | β |
| Embedded DSP Blocks | Yes (18x18 multiplier blocks) | β |
| User I/Os | 742 | β |
| Process Technology | 90 nm | β |
| Core Voltage | 1.2 V | 1.2 V |
| Maximum Internal Clock Frequency | 778.82 MHz | β |
| Package | 1020-ball FC-FBGA | 1020-ball FBGA (flip-chip BGA) |
| Speed Grade | C3 | C3 |
| Temperature Grade | Commercial (0C to +85C) | β |
| PLLs | 12 (8 fast PLLs + 4 enhanced PLLs) | β |
| Configuration Modes | PS, PPS, PPA, JTAG | β |
| Configuration Encryption | 128-bit AES | β |
| RoHS Status | [DATA_NEEDED: rohs status] | [DATA_NEEDED: RoHS status] |
| On-chip Termination (OCT) | Yes (series, parallel, dynamic) | β |
| Series | β | Stratix II |
| Device Family | β | EP2S180 |
| Equivalent Logic Elements (LEs) | β | 179,400 |
| Embedded Memory (RAM bits) | β | 9,383,040 |
| Maximum User I/Os | β | 742 |
| Mounting Type | β | Surface Mount |
| Process Node | β | 90 nm, all-layer copper SRAM |
| Operating Temperature | β | Commercial (0C to +85C) |
| DSP Blocks | β | Dedicated high-speed multipliers |
| Memory Interfaces Supported | β | DDR2 SDRAM, QDRII SRAM, RLDRAM II |
| I/O Standards | β | LVDS, LVPECL, SSTL, HSTL |
| Configuration Method | β | SRAM-based (volatile, requires boot device) |
| Development Toolchain | β | Quartus II / Quartus Prime |