EP2SGX30CF780C3 vs EP2SGX30CF780C6 Comparison

Detailed side-by-side comparison of EP2SGX30CF780C3 by Intel and EP2SGX30CF780C6 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2SGX30CF780C3 EP2SGX30CF780C6
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $175.50 $165.00
Family Stratix II GX Stratix II GX
Logic Elements 33,880 β€”
Logic Array Blocks (LABs) 1,694 β€”
Embedded RAM Bits 1,369,728 β€”
User I/Os 361 β€”
Package 780-ball FineLine BGA 780-ball FineLine BGA (F780)
Process Node 90 nm β€”
Speed Grade -3 C6 (commercial, mid-speed)
Operating Temperature 0C to +85C (commercial) 0C to +85C (commercial)
Transceivers Embedded (GX family, up to 3.125 Gbps per channel) β€”
Memory Interfaces DDR / DDR2 / QDRII PHY β€”
Mounting Type Surface Mount (BGA) β€”
RoHS Status Compliant [DATA_NEEDED: RoHS status]
Lead-Free Yes [DATA_NEEDED: lead-free status]
Halogen-Free [DATA_NEEDED: halogen-free status] β€”
Series β€” EP2SGX
Logic Elements (LE) β€” 33,880
Adaptive Logic Modules (ALM) β€” 13,540
Embedded Memory Bits β€” 1,369,728 bits (171 KBytes)
Embedded Multiplier 18x18 β€” 64 (estimated, datasheet required for exact count)
User I/O Pins β€” 361
High-Speed Transceivers β€” Up to 8 channels (FPGA-dependent configuration)
Transceiver Data Rate β€” Up to 6.375 Gbps
Core Voltage β€” 1.2 V (typical)
Configuration Mode β€” Enhanced passive/active (EPC) supported
Process Technology β€” 90 nm

Datasheets & Resources

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