EP2SGX30DF780I7N vs EP2SGX30DF780I3N Comparison
Detailed side-by-side comparison of EP2SGX30DF780I7N by Intel and EP2SGX30DF780I3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2SGX30DF780I7N | EP2SGX30DF780I3N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $188.00 | $171.00 |
| Series | Stratix II GX | β |
| Family | Stratix II GX (Enhanced Configuration / EPC) | Stratix II GX |
| Logic Elements | 33,880 LEs | 33,880 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | β |
| Embedded Memory (bits) | 1,369,728 bits | β |
| Total RAM Blocks | M512/M4K/M-RAM TriMatrix | β |
| Embedded Multipliers | [DATA_NEEDED: 18x18 multiplier count] | β |
| Maximum User I/O | 586 user I/O pins | β |
| Multi-Gigabit Transceivers (MGTs) | Up to 16 full-duplex channels, 600 Mbps to 3.125 Gbps | β |
| MGT Protocols Supported | PCIe, XAUI, CPRI, OBSAI, Serial RapidIO, GbE | β |
| Package | 780-ball FineLine BGA | 780-ball FBGA (Fine-Pitch BGA), 29 x 29 mm, 1 mm pitch |
| Core Voltage | 1.2 V (typical) | β |
| Process Technology | 90 nm | 90 nm CMOS |
| Operating Temperature | -40C to +100C (Industrial) | β |
| Speed Grade | 7 (fastest commercial speed grade) | I3 |
| Configuration Mode | Active Serial (EPCS), Passive Serial, JTAG, Fast Passive Parallel | β |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| RoHS Status | [DATA_NEEDED: RoHS compliance] | Compliant |
| MSL Level | [DATA_NEEDED: moisture sensitivity level] | β |
| Logic Cells | β | 33,380 |
| Configurable Logic Blocks (CLBs) | β | 33,880 |
| Total Memory Bits | β | 1,369,728 |
| Maximum Core Frequency | β | 622.08 MHz |
| Core Supply Voltage | β | 1.2 V |
| User I/O Pins | β | 361 |
| Operating Temperature Grade | β | Industrial |
| Lead Free | β | Yes |