EP2SGX60CF780C3 vs EP2SGX60CF780C3N Comparison
Detailed side-by-side comparison of EP2SGX60CF780C3 by Intel and EP2SGX60CF780C3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP2SGX60CF780C3N - Stratix II GX FPGA 60K LE 780-FBGA | Intel
EP2SGX60CF780C3N β Last Time BuySpecification Comparison
| Parameter | EP2SGX60CF780C3 | EP2SGX60CF780C3N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Last_time_buy |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $870.00 | $285.00 |
| Family | Stratix II GX | β |
| Device Type | FPGA - Field Programmable Gate Array | FPGA (Field Programmable Gate Array) |
| Logic Elements | 60,440 | 60,440 |
| Logic Array Blocks (LABs) | 3,022 | [DATA_NEEDED: LAB count] |
| On-chip RAM Bits | 2,544,192 (~317 KB) | β |
| User I/Os | 364 | β |
| Transceivers | Up to 12 multi-gigabit transceivers (per family datasheet) | β |
| Transceiver Data Rate (max) | 6.375 Gbps (per Stratix II GX family datasheet) | β |
| Core Voltage | 1.2 V | β |
| Process Technology | 90 nm CMOS, SRAM-based | 90 nm CMOS |
| Speed Grade | C3 (commercial) | β |
| Package | 780-ball FineLine BGA (FBGA-780), 29 mm x 29 mm, 1.0 mm pitch | β |
| Operating Temperature | Commercial (0C to +85C junction) | β |
| Mounting Type | Surface Mount (BGA) | β |
| MSL Level | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL rating] |
| RoHS Status | [DATA_NEEDED: RoHS status] | Lead-free / Compliant |
| Series | β | Stratix II GX |
| User I/O Pins | β | 364 |
| Embedded Memory (bits) | β | 2,544,192 |
| Number of CLBs | β | 60,440 |
| Internal Frequency (max) | β | 816.9 MHz |
| Core Supply Voltage | β | 1.2 V |
| Transceiver Channels | β | 12 (up to 6.375 Gbps) |
| Package Type | β | 780-ball FC-FBGA |
| Package Dimensions | β | 29 mm x 29 mm, 1.0 mm pitch |