EP2SGX60CF780C4 vs EP2SGX60CF780C3N Comparison
Detailed side-by-side comparison of EP2SGX60CF780C4 by Intel and EP2SGX60CF780C3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP2SGX60CF780C3N - Stratix II GX FPGA 60K LE 780-FBGA | Intel
EP2SGX60CF780C3N β Last Time BuySpecification Comparison
| Parameter | EP2SGX60CF780C4 | EP2SGX60CF780C3N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Last_time_buy |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $171.00 | $285.00 |
| Device Family | Stratix II GX | β |
| Logic Elements | 60,440 | 60,440 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | β |
| LABs/CLBs | 3,022 | β |
| User I/O Count | 364 | β |
| Total Memory Bits | 2,544,192 | β |
| Number of Transceivers | [DATA_NEEDED: number of transceivers] | β |
| Internal Operating Frequency | up to 732.1 MHz | β |
| Propagation Delay | [DATA_NEEDED: propagation delay ns] | β |
| Process Technology | 90 nm | 90 nm CMOS |
| Core Supply Voltage | 1.2 V | 1.2 V |
| Package | 780-ball FC-FBGA (23 x 23 mm, 1 mm pitch) | β |
| Package Type | Flip-Chip Fine-Pitch BGA | 780-ball FC-FBGA |
| Speed Grade | C4 (commercial) | β |
| Operating Temperature | Commercial (0C to +85C) [DATA_NEEDED: exact TJ range] | β |
| Mounting Type | Surface Mount | β |
| RoHS Status | [DATA_NEEDED: RoHS compliance] | Lead-free / Compliant |
| Device Type | β | FPGA (Field Programmable Gate Array) |
| Series | β | Stratix II GX |
| Logic Array Blocks (LABs) | β | [DATA_NEEDED: LAB count] |
| User I/O Pins | β | 364 |
| Embedded Memory (bits) | β | 2,544,192 |
| Number of CLBs | β | 60,440 |
| Internal Frequency (max) | β | 816.9 MHz |
| Transceiver Channels | β | 12 (up to 6.375 Gbps) |
| Package Dimensions | β | 29 mm x 29 mm, 1.0 mm pitch |
| MSL Level | β | [DATA_NEEDED: MSL rating] |