EP2SGX60CF780C4 vs EP2SGX60DF780C4 Comparison
Detailed side-by-side comparison of EP2SGX60CF780C4 by Intel and EP2SGX60DF780C4 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2SGX60CF780C4 | EP2SGX60DF780C4 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $171.00 | $1,350.00 |
| Device Family | Stratix II GX | Stratix II GX |
| Logic Elements | 60,440 | 60,440 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | β |
| LABs/CLBs | 3,022 | β |
| User I/O Count | 364 | 364 |
| Total Memory Bits | 2,544,192 | β |
| Number of Transceivers | [DATA_NEEDED: number of transceivers] | β |
| Internal Operating Frequency | up to 732.1 MHz | β |
| Propagation Delay | [DATA_NEEDED: propagation delay ns] | β |
| Process Technology | 90 nm | 90 nm CMOS |
| Core Supply Voltage | 1.2 V | 1.2 V |
| Package | 780-ball FC-FBGA (23 x 23 mm, 1 mm pitch) | β |
| Package Type | Flip-Chip Fine-Pitch BGA | 780-ball FC-FBGA |
| Speed Grade | C4 (commercial) | 4 (C4) |
| Operating Temperature | Commercial (0C to +85C) [DATA_NEEDED: exact TJ range] | β |
| Mounting Type | Surface Mount | Surface Mount |
| RoHS Status | [DATA_NEEDED: RoHS compliance] | Compliant |
| Embedded Memory Bits | β | 2,544,192 |
| Maximum Internal Frequency | β | 717 MHz |
| Transceiver Channels | β | [DATA_NEEDED: exact transceiver count and data rate] |
| Number of CLBs | β | 60,440 |
| Package Dimensions | β | 29 x 29 mm |
| Ball Pitch | β | 1.0 mm |
| Operating Temperature Grade | β | Commercial (C) |