EP2SGX90FF1508C3 vs EP2SGX90FF1508C3ES Comparison

Detailed side-by-side comparison of EP2SGX90FF1508C3 by Intel and EP2SGX90FF1508C3ES by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2SGX90FF1508C3 EP2SGX90FF1508C3ES
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $1,380.00 $1,340.00
Family Stratix II GX Stratix II GX
Logic Elements 90,960 90,960
LABs / CLBs 4,548 β€”
Total Memory Bits 4,520,448 β€”
Maximum User I/O 650 β€”
Number of Transceivers 4 (per family datasheet) β€”
Core Voltage 1.2 V β€”
Operating Temperature 0C to +85C (commercial) β€”
Speed Grade -3 β€”
Process Technology 90 nm CMOS 90 nm CMOS
Package Type 1508-ball FC-FBGA (FBGA-1508) β€”
Package Dimensions 40 x 40 mm β€”
Ball Pitch 1.0 mm β€”
Mounting Type Surface Mount (Tray) Surface Mount
RoHS Status Compliant [DATA_NEEDED: rohs]
Configuration Method SRAM-based, JTAG / Passive / Active serial β€”
Logic Array Blocks (LABs) β€” 4,828
Embedded Memory (TriMatrix) β€” 4,520,448 bits
Total RAM Bits β€” 4,520,448
Core Supply Voltage β€” 1.2 V
Maximum Internal Frequency β€” 816.9 MHz
DSP Blocks β€” Yes (dedicated multiplier blocks)
Embedded Transceivers β€” Up to 3.125 Gbps multi-gigabit transceivers
Global Clock Networks β€” Up to 16
Regional Clock Networks β€” Up to 32 per device region
Package β€” 1508-ball FC-FBGA (Flip-Chip FineLine BGA), 1.00 mm pitch
Configuration Interface β€” JTAG / EPCS serial flash / Passive parallel
Operating Temperature Grade β€” Commercial / Industrial (per part suffix)

Datasheets & Resources

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