EP2SGX90FF1508C3ES vs EP2SGX90FF1508C3 Comparison

Detailed side-by-side comparison of EP2SGX90FF1508C3ES by Intel and EP2SGX90FF1508C3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2SGX90FF1508C3ES EP2SGX90FF1508C3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $1,340.00 $1,380.00
Family Stratix II GX Stratix II GX
Logic Elements 90,960 90,960
Logic Array Blocks (LABs) 4,828 β€”
Embedded Memory (TriMatrix) 4,520,448 bits β€”
Total RAM Bits 4,520,448 β€”
Process Technology 90 nm CMOS 90 nm CMOS
Core Supply Voltage 1.2 V β€”
Maximum Internal Frequency 816.9 MHz β€”
DSP Blocks Yes (dedicated multiplier blocks) β€”
Embedded Transceivers Up to 3.125 Gbps multi-gigabit transceivers β€”
Global Clock Networks Up to 16 β€”
Regional Clock Networks Up to 32 per device region β€”
Package 1508-ball FC-FBGA (Flip-Chip FineLine BGA), 1.00 mm pitch β€”
Mounting Type Surface Mount Surface Mount (Tray)
Configuration Interface JTAG / EPCS serial flash / Passive parallel β€”
Operating Temperature Grade Commercial / Industrial (per part suffix) β€”
RoHS Status [DATA_NEEDED: rohs] Compliant
LABs / CLBs β€” 4,548
Total Memory Bits β€” 4,520,448
Maximum User I/O β€” 650
Number of Transceivers β€” 4 (per family datasheet)
Core Voltage β€” 1.2 V
Operating Temperature β€” 0C to +85C (commercial)
Speed Grade β€” -3
Package Type β€” 1508-ball FC-FBGA (FBGA-1508)
Package Dimensions β€” 40 x 40 mm
Ball Pitch β€” 1.0 mm
Configuration Method β€” SRAM-based, JTAG / Passive / Active serial

Datasheets & Resources

Browse All Products Create BOM Request Quote