EP3C25F324C6N vs EP3C25F324C8 Comparison
Detailed side-by-side comparison of EP3C25F324C6N by Intel and EP3C25F324C8 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C25F324C6N | EP3C25F324C8 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $62.30 | $23.10 |
| Series | Cyclone III | Cyclone III |
| Family | Cyclone III (low-power, low-cost FPGA) | β |
| Logic Elements (LE) | 24,624 | β |
| Total Memory Bits | 608,256 bits | β |
| Embedded Memory Blocks | M9K blocks, 66 total | β |
| Embedded Multipliers | 66 (18x18) | 66 (18 x 18) |
| DSP Blocks | 66 dedicated 18x18 multipliers | β |
| User I/O Pins | 215 | β |
| Number of I/O Banks | 8 | β |
| PLLs | 4 general-purpose PLLs | 4 |
| Package | 324-BGA (FBGA-324), fine-pitch | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch |
| Speed Grade | C6 (commercial) | 8 (commercial) |
| Operating Temperature | 0C to +85C (commercial) | 0 Β°C to +85 Β°C (commercial) |
| Process Technology | TSMC 65 nm low-power (LP) | 65 nm CMOS, SRAM-based |
| Configuration Schemes | Passive Serial, Fast Passive Parallel, JTAG | β |
| Lead-Free / RoHS | Yes (lead-free, RoHS compliant) | β |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| Logic Elements | β | 24,624 LE |
| Logic Array Blocks | β | 1,539 LABs |
| Embedded Memory | β | 608,256 bits |
| User I/Os | β | 215 |
| Core Voltage | β | 1.2 V |
| Maximum Internal Clock | β | 402 MHz |
| RoHS Status | β | Non-compliant (per Lisleapex listing; original part number without 'N' suffix) |