EP3C25F324C6N vs EP3C25F324C8N Comparison
Detailed side-by-side comparison of EP3C25F324C6N by Intel and EP3C25F324C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C25F324C6N | EP3C25F324C8N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $62.30 | $27.10 |
| Series | Cyclone III | Cyclone III |
| Family | Cyclone III (low-power, low-cost FPGA) | Cyclone III |
| Logic Elements (LE) | 24,624 | β |
| Total Memory Bits | 608,256 bits | 608,256 bits |
| Embedded Memory Blocks | M9K blocks, 66 total | β |
| Embedded Multipliers | 66 (18x18) | β |
| DSP Blocks | 66 dedicated 18x18 multipliers | β |
| User I/O Pins | 215 | β |
| Number of I/O Banks | 8 | β |
| PLLs | 4 general-purpose PLLs | β |
| Package | 324-BGA (FBGA-324), fine-pitch | 324-BGA (FineLine) |
| Speed Grade | C6 (commercial) | 8 |
| Operating Temperature | 0C to +85C (commercial) | 0 C to +85 C (commercial, suffix C) |
| Process Technology | TSMC 65 nm low-power (LP) | β |
| Configuration Schemes | Passive Serial, Fast Passive Parallel, JTAG | β |
| Lead-Free / RoHS | Yes (lead-free, RoHS compliant) | β |
| Mounting Type | Surface Mount | Surface Mount |
| Logic Elements (LEs) | β | 24,624 |
| Embedded Memory (Kbits) | β | 608 Kbits |
| Number of I/O | β | 215 |
| Supply Voltage - Core | β | 1.2 V |
| Total RAM Bits | β | 608,256 |
| Process Node | β | 60 nm low-power CMOS |
| Number of Multipliers (18x18) | β | 66 |
| Number of PLLs | β | 4 |
| RoHS Status | β | Compliant |