EP3C25F324C6N vs EP3C25F324I7 Comparison
Detailed side-by-side comparison of EP3C25F324C6N by Intel and EP3C25F324I7 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C25F324C6N | EP3C25F324I7 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $62.30 | $64.80 |
| Series | Cyclone III | Cyclone III |
| Family | Cyclone III (low-power, low-cost FPGA) | β |
| Logic Elements (LE) | 24,624 | β |
| Total Memory Bits | 608,256 bits | β |
| Embedded Memory Blocks | M9K blocks, 66 total | β |
| Embedded Multipliers | 66 (18x18) | β |
| DSP Blocks | 66 dedicated 18x18 multipliers | β |
| User I/O Pins | 215 | β |
| Number of I/O Banks | 8 | β |
| PLLs | 4 general-purpose PLLs | 4 |
| Package | 324-BGA (FBGA-324), fine-pitch | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch |
| Speed Grade | C6 (commercial) | β |
| Operating Temperature | 0C to +85C (commercial) | β |
| Process Technology | TSMC 65 nm low-power (LP) | TSMC 65 nm low-power CMOS |
| Configuration Schemes | Passive Serial, Fast Passive Parallel, JTAG | β |
| Lead-Free / RoHS | Yes (lead-free, RoHS compliant) | β |
| Mounting Type | Surface Mount | Surface Mount |
| Logic Elements (LEs) | β | 24,624 |
| Logic Array Blocks (LABs) | β | 1,539 |
| Embedded Memory | β | 608,256 bits (594 Kbits M9K blocks) |
| Embedded 18x18 Multipliers | β | 66 |
| Global Clock Networks | β | 20 |
| Maximum User I/O | β | 215 |
| Core Voltage (VCCINT) | β | 1.2 V |
| I/O Voltage (VCCIO) | β | 1.2 V to 3.3 V (per bank) |
| Operating Junction Temperature | β | -40 Β°C to +100 Β°C (industrial) |
| Configuration Modes | β | Passive Serial (PS), Active Serial (AS), JTAG |
| RoHS Status | β | Compliant |