EP3C25F324C8 vs EP3C25F324C6N Comparison
Detailed side-by-side comparison of EP3C25F324C8 by Intel and EP3C25F324C6N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP3C25F324C6N
EP3C25F324C6N - Cyclone III FPGA 25K LE 215 I/O 324-BGA | Intel
EP3C25F324C6N β ActiveSpecification Comparison
| Parameter | EP3C25F324C8 | EP3C25F324C6N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $23.10 | $62.30 |
| Series | Cyclone III | Cyclone III |
| Logic Elements | 24,624 LE | β |
| Logic Array Blocks | 1,539 LABs | β |
| Embedded Memory | 608,256 bits | β |
| Embedded Multipliers | 66 (18 x 18) | 66 (18x18) |
| User I/Os | 215 | β |
| PLLs | 4 | 4 general-purpose PLLs |
| Process Technology | 65 nm CMOS, SRAM-based | TSMC 65 nm low-power (LP) |
| Core Voltage | 1.2 V | β |
| Speed Grade | 8 (commercial) | C6 (commercial) |
| Operating Temperature | 0 Β°C to +85 Β°C (commercial) | 0C to +85C (commercial) |
| Package | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch | 324-BGA (FBGA-324), fine-pitch |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| Maximum Internal Clock | 402 MHz | β |
| RoHS Status | Non-compliant (per Lisleapex listing; original part number without 'N' suffix) | β |
| Family | β | Cyclone III (low-power, low-cost FPGA) |
| Logic Elements (LE) | β | 24,624 |
| Total Memory Bits | β | 608,256 bits |
| Embedded Memory Blocks | β | M9K blocks, 66 total |
| DSP Blocks | β | 66 dedicated 18x18 multipliers |
| User I/O Pins | β | 215 |
| Number of I/O Banks | β | 8 |
| Configuration Schemes | β | Passive Serial, Fast Passive Parallel, JTAG |
| Lead-Free / RoHS | β | Yes (lead-free, RoHS compliant) |