EP3C25F324I7 vs EP3C16F484I7 Comparison

Detailed side-by-side comparison of EP3C25F324I7 by Intel and EP3C16F484I7 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3C25F324I7 EP3C16F484I7
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Active
Stock Status In Stock In Stock
Unit Price (USD) $64.80 $58.10
Series Cyclone III β€”
Logic Elements (LEs) 24,624 β€”
Logic Array Blocks (LABs) 1,539 963
Embedded Memory 608,256 bits (594 Kbits M9K blocks) β€”
Embedded 18x18 Multipliers 66 56
PLLs 4 β€”
Global Clock Networks 20 β€”
Maximum User I/O 215 β€”
Process Technology TSMC 65 nm low-power CMOS β€”
Core Voltage (VCCINT) 1.2 V β€”
I/O Voltage (VCCIO) 1.2 V to 3.3 V (per bank) β€”
Operating Junction Temperature -40 Β°C to +100 Β°C (industrial) β€”
Package 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch 484-ball FineLine BGA (F484)
Mounting Type Surface Mount Surface Mount
Configuration Modes Passive Serial (PS), Active Serial (AS), JTAG β€”
RoHS Status Compliant Compliant
Family β€” Cyclone III
Manufacturer β€” Intel (formerly Altera)
Logic Elements β€” 15,408
Total Embedded Memory β€” 516,096 bits (63 KB)
Embedded Memory Blocks β€” M9K x 56
User I/Os β€” 346
General-Purpose PLLs β€” 4
Operating Temperature β€” -40C to +100C (industrial)
Speed Grade β€” 7 (fastest commercial/industrial)
Process Node β€” 60 nm TSMC low-power
Configuration Method β€” Passive Serial, Fast Passive Parallel, Active Serial, JTAG

Datasheets & Resources

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