EP3C25F324I7 vs EP3C25F324C6N Comparison
Detailed side-by-side comparison of EP3C25F324I7 by Intel and EP3C25F324C6N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C25F324I7 | EP3C25F324C6N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $64.80 | $62.30 |
| Series | Cyclone III | Cyclone III |
| Logic Elements (LEs) | 24,624 | β |
| Logic Array Blocks (LABs) | 1,539 | β |
| Embedded Memory | 608,256 bits (594 Kbits M9K blocks) | β |
| Embedded 18x18 Multipliers | 66 | β |
| PLLs | 4 | 4 general-purpose PLLs |
| Global Clock Networks | 20 | β |
| Maximum User I/O | 215 | β |
| Process Technology | TSMC 65 nm low-power CMOS | TSMC 65 nm low-power (LP) |
| Core Voltage (VCCINT) | 1.2 V | β |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V (per bank) | β |
| Operating Junction Temperature | -40 Β°C to +100 Β°C (industrial) | β |
| Package | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch | 324-BGA (FBGA-324), fine-pitch |
| Mounting Type | Surface Mount | Surface Mount |
| Configuration Modes | Passive Serial (PS), Active Serial (AS), JTAG | β |
| RoHS Status | Compliant | β |
| Family | β | Cyclone III (low-power, low-cost FPGA) |
| Logic Elements (LE) | β | 24,624 |
| Total Memory Bits | β | 608,256 bits |
| Embedded Memory Blocks | β | M9K blocks, 66 total |
| Embedded Multipliers | β | 66 (18x18) |
| DSP Blocks | β | 66 dedicated 18x18 multipliers |
| User I/O Pins | β | 215 |
| Number of I/O Banks | β | 8 |
| Speed Grade | β | C6 (commercial) |
| Operating Temperature | β | 0C to +85C (commercial) |
| Configuration Schemes | β | Passive Serial, Fast Passive Parallel, JTAG |
| Lead-Free / RoHS | β | Yes (lead-free, RoHS compliant) |